EMVCo Newsletter: Q2 2025

Message from the Chair of the EMVCo Board of Managers Broad engagement with the payments ecosystem is vital to shaping EMVCo’s strategic and technical priorities, as well as promoting the innovation that drives the ongoing development and enhancement of EMV® Specifications. It has been another busy quarter in this regard, with the EMVCo community coming together for both our Technical Meeting in Bangkok, Thailand and annual EMV User Meeting in Osaka, Japan. The second half of 2025 opens in a similar vein, with three Special Interest Meetings (SIMs) scheduled for July. The first meeting is focused on Chip Cryptography, and follows the recent publication of a series of educational materials exploring how EMV Chip technology promotes cybersecurity and the role of EMVCo in enabling safe and reliable payments globally. EMVCo is also hosting two instances of a dedicated SIM on EMV Payment Tokenisation, exploring the use of Payment Account Reference (PAR) data across the industry today and how it could be enhanced for the future. More information on key EMVCo news, technical updates and activities from the second quarter is included below, along with a snapshot of the latest educational resources to support understanding of EMVCo’s work. We encourage you to share this newsletter with your colleagues and industry peers. Finally, as the EMVCo Board of Managers rotates the position every 12 months, this will be my last newsletter as Chair. I am pleased to welcome Mark Rigby to the role, and look forward to continuing to work with him, the EMVCo community and the wider payments industry to advance EMV Specifications and support the global delivery of seamless and secure payments. Soumya Chakrabarty Chair of EMVCo Board of Managers, 2024 – 2025 Upcoming Meetings Associates can register for the following sessions via the EMVCo website. EMVCo Special Interest Meeting on Chip Cryptography, 01 July 2025, Online (7 am PT) EMVCo Special Interest Meeting on Payment Tokenisation, 22 July 2025, Online (7 am PT) EMVCo Special Interest Meeting on Payment Tokenisation, 22 July 2025, Online (3 pm PT) Board of Advisors Meeting, 21-22 October 2025, Charleston, USA Technical Meeting, 17-20 November 2025, Vienna, Austria *EMVCo Subscribers are also invited to these meetings.  Not yet an EMVCo Associate? Find out more about how to participate. News How EMV Chip Addresses Cybersecurity in Payments EMVCo has published a series of new educational materials to support industry understanding of its work to promote cybersecurity in payments. These include delving into how EMV Chip technology helps secures a payment transaction, the role of cryptography in EMV Chip payment security, and the potential future impact of quantum computing on EMV Chip technology and how EMVCo is proactively addressing it. Sign up for our upcoming Special Interest Meeting on Chip Cryptography here. Use of the EUDI Wallet in EMV 3-D Secure (3DS) Payment Authentication EMVCo has published a whitepaper and EMV Insights post exploring the requirements of the EMV 3DS protocol when integrating with an authentication method such as the European Union Digital Identity (EUDI) Wallet. Learn more here. Technical Updates EMV Secure Remote Commerce (SRC) Specifications – Version Management EMVCo has published a Version Management document to govern revisions to the SRC Specifications as they evolve over time. The document is intended for use by implementers of the SRC Specifications and is specific to the SRC API and SRC JavaScript SDK documents within the SRC Specifications. SB nº 313: Update to Book C-5 Details updates to several sections in the EMV Contactless Specifications for Payment Systems, Book C-5, Kernel 5 Specification. SB nº 312: CPS DGIs for Block Cipher Key Personalisation Introduces new Data Grouping Identifiers in the EMV Card Personalisation Specification. SB nº 311: Updates to EMV Contactless Book C-2 Details updates to several sec