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EMV® Mobile Product Level 1 Implementation Conformance Statement

v3.0b1 Type Approval Forms
ContactlessMobile NFC Consumer Device

Export Form Data Import Form Data EMV® Mobile Product Level 1 Implementation Conformance Statement Version 33..00bb11 ICS reference number and validity period (for EMVCo administrative use only) ICS reference number: Valid from: Valid to: Notice: This ICS form shall be completed for mobile products submitted for Level 1 evaluation. The form shall be completed in its entirety. All yes and no questions shall be answered. If a feature/option is NOT supported, i.e. if a question is answered “No”, the sub-questions for that feature/question shall be left blank. A

  • Administrative Product Provider identification A.1.1 – Company legal name: (as listed on the Registration Letter) A.1.2 – EMVCo Registration Number: Laboratory identification A.1.3
  • Company legal name: A.1.4 – EMVCo Registration Number: ICS submission type A.2.1
  • Select submission type A.2.2
  • For any submission except Initial, please provide the EMVCo letter of approval reference number of the previously approved product (if already granted) A.2.3 – Is this ICS a replacement Yes No of a previously accepted ICS? A.2.4 – If yes, please provide the reference number of the previously accepted ICS A.2.5
  • If yes, please provide the reason for replacing the ICS <ct> A.2.6 – If yes, please provide details of ICS replacement Number: Mobile product specification references Name Version number Release date Released by A.3.1 – EMV Contactless Specification EMV Level 1 33.0.0 Contactless Specifications for Payment Systems – EMV Contactless Interface Specification A.3.2 – EMV Bulletins (list all applicable) FFeebrburauryar2y0128 Audit report tracking number Number: Mobile product descriptions A.4.1 – Mobile product commercial name (optional – may be left blank) A.4.2 – Mobile product technical name A.4.3 – Mobile product form factor A.4.3.1 – Is this mobile a wearable product? Wearable Description:
  • Watch?
  • Ring?
  • Other? (please describe) A.4.3.2 – Is this mobile a foldable product? A.4.3.3 – Is this mobile a non-card L1 form factor? A.4.4 – Mobile product Type Allocation Code (TAC) Note: TAC is the initial 8 digits portion of the IMEI. If the TAC for production is not known before the test session its value may be left empty but it must be provided in an updated ICS before the issuance of the Letter of Approval. Note: If TAC is not available for the product, a Product Reference Number shall be used instead. A Product Reference Number is a unique identification or model number that has an equivalent meaning as a TAC for a mobile phone. Yes No Yes Yes Yes Yes No Yes No TAC for testing sample: TAC for production: A.4.5 – Mobile product technical version Note: The technical version shall be unique across all identical mobile product technical name A.4.6 – Mobile product submitted for: A.4.7 – Execution Environment (EE) submitted: Note: the UICC slots shall be clearly identified in the samples. Note: this template assumes that a product does not support both eSE and eUICC. Please contact EMVCo if this product supports both. A.4.8 – Target market/operator (optional – may be left blank) A.4.9 – Mobile product Operating System (OS) name A.4.10 – Mobile product Operating System (OS) version A.4.11 – Details of API supported by the mobile product for wallet deployment/development (e.g. JAVA, native etc.) A.4.12 – NFC controller provider name A.4.13 – NFC controller name Test Assessment Summary or Letter of Approval UICC slot 1 UICC slot 2 eSE HCE eUICC Number: A.4.14 – NFC controller version number A.4.15 – NFC controller firmware name A.4.16 – NFC controller firmware version number A.4.17 – Middleware/CLF driver software name (in mobile product) A.4.18 – Middleware/CLF driver software version (in mobile product) A.4.19 –eSE or eUICC available? A.4.19.1 –eSE or eUICC provider name A.4.19.2 –eSE or eUICC name A.4.19.3 –eSE or eUICC version number A.4.19.4 –eSE or eUICC firmware name A.4.19.5 –eSE or eUICC firmware version number A.4.20 – UICC form factor Yes No UICC slot 1: A.4.21 – Supports which EMV CL technologies Type A Type B A.4.22 – Are other proprietary contactless technologies supported? Yes No A.4.22.1 – If yes, please list all supported proprietary technologies (e.g. Felica, ISO 15693, ISO 18092, Innovatron, etc.)? A.4.22.2 – Can the other proprietary technologies Yes No be disabled? A.4.22.3 – If yes, please indicate how they can be enabled/disabled? Note: During testing, all contactless functionalities of the DUT that can be activated together with the test application shall be enabled (e.g. NFC-F, P2P, R/W Mode etc.). A.4.23 – SWP spec version supported (ETSI TS 102.613) Note: Only if UICC is a submitted EE. A.4.24 – HCI spec version supported (ETSI TS 102.622 – e.g. 11.01.00) Note: Only if UICC is a submitted EE. A.4.25 – What is the default EE? A.4.26 – How is the default EE determined? A.4.27 – Does the mobile product support payment in Low Power Mode? If yes, does Low Power Mode affect the analogue and/or digital parameters? Yes No Yes No UICC slot 2: Number: Mobile product preparation for mobile testing A.5.1 – If the mobile product supports UICC for payment application but is not ready for testing when the UICC has been inserted, please describe how the mobile product shall be prepared for mobile testing. UICC slot 1: A.5.2 – If the mobile product supports eSE or eUICC for payment application, please describe how the mobile product shall be prepared for mobile testing (activate the test application): A.5. 3 – If the mobile product supports eSE or eUICC for Yes No payment application, does the mobile product permit the laboratory to change its digital configuration? A.5. 3.1 – If the mobile product supports eSE or eUICC for payment application and if the mobile product permits the laboratory to change its digital configuration, please describe how to change the test profile: A.5.4 – If the mobile product supports eSE or eUICC, and other EE, please describe how to ensure that no application is activated in the eSE or eUICC when testing other EE: A.5.5 – If the mobile product supports HCE for payment application, please describe how the mobile product shall be prepared for mobile testing (activate the test application): A.5.6 – If the mobile product supports HCE for payment Yes No application, does the mobile product permit the laboratory to change its digital configuration? A.5.6.1 – If the mobile product supports HCE for payment application and if the mobile product permits the laboratory to change its digital configuration, please describe how to change the test profile: A.5.7 – If the mobile product supports HCE and other EE, please describe how to ensure that no application is activated in the HCE when testing other EE: Mobile product description with multiple EE activated A.6.1 – For device supporting SWP + HCE, with HCE enabled and SWP UICC inserted, where are the digital parameters to be used for EMV transactions defined? Type A: Type B: A.6.2 – For device supporting eSE + HCE or eUICC + HCE, with eSE or eUICC enabled and HCE enabled, where are the digital parameters to be used for EMV transaction defined? Type A: Type B: A.6.3 – For device supporting SWP + eSE or SWP + eUICC, with SWP UICC inserted and eSE or eUICC enabled, where are the digital parameters to be used for EMV transactions defined? Type A: Type B: A.6.4 – For device supporting SWP + eSE + HCE or SWP + eUICC + HCE, with SWP UICC inserted, eSE or eUICC enabled and HCE enabled, where are the digital parameters to be used for EMV transactions defined? Type A: Type B: UICC slot 2: Number: Level 1 analogue characteristics L1A.1 – Sample information L1A.1.1 – Please give any unambiguous information on how the top side of the device is defined. E.g.: The top is the side with the power switch. L1A.2 – Sample information with UICC as EE (Execution Environment) L1A.2.1 – EMV contactless protocol type(s) supported? UICC slot 1: A B UICC slot 2: A B L1A.2.2 – If both EMV contactless protocol types are supported, please explain the mechanism implemented to ensure that the mobile product replies to a single wake-up command during polling: UICC slot 1: UICC slot 2: L1A.3 – Sample information with eSE or eUICC as EE (Execution Environment) L1A.3.1 – EMV contactless protocol type(s) supported? A B L1A.3.2 – If both EMV contactless protocol types are supported, please explain the mechanism implemented to ensure that the mobile product replies to a single wake-up command during polling: L1A.4 – Sample information with HCE as EE (Execution Environment) L1A.4.1 – EMV contactless protocol type(s) supported? A B L1A.4.2 – If both EMV contactless protocol types are supported, please explain the mechanism implemented to ensure that the mobile product replies to a single wake-up command during polling: L1A.5 – Power supply L1A.5.1 – Type of power supply? Powered by the PCD field (Passive Device) Self-powered L1A.5.1.1 – If self-powered, value of the nominal voltage of the battery: L1A.6 – Antenna L1A.6.1 – Name L1A.6.2 – Version L1A.6.3 – Proximity antenna provider names L1A.6.3.1 – If there are several proximity antenna providers, provide the name of the proximity antenna of each sample submitted for type approval. Number: L1A.6.4 – Proximity antenna location in mobile product (e.g. battery, back cover etc…) L1A.6.5 – Format and number of turns of the mobile product antenna. L1A.6.6a – Does the antenna design include ferrite component? Yes No L1A.6.6b – If yes, provide description including ferrite part number: L1A.6.6c – If yes, provide the name of the ferrite manufacturer: L1A.6.6d – If yes, provide the ferrite serial number: L1A.6.6e – If yes, provide the ferrite size: L1A.6.6f – If yes, provide the ferrite positioning from the antenna: If answer to A.4.3.1 is no, fill in sections L1A.6.7 and L1A.6.8 L1A.6.7 – Please complete the c = measurements (in mm) for the antenna size and location as show in the example diagram d = x = y = Number: L1A.6.8
  • Please complete the a = b = measurements (in mm) for the Reference Mark as shown in the example diagram a: Distance from rear left side to reference mark b: Distance from rear top side to reference mark Number: If answer to A.4.3.1 is yes, fill in sections L1A.6.9 to L1A.6.11 L1A.6.9
  • Please provide an unambiguous diagram providing the antenna size and location. L1A.6.10
  • Please provide an unambiguous diagram providing exact position for the Reference Mark. Note: The Reference Mark shall be part of the Presentation Plane. (No offset due to the wearable product can be considered.) Number: L1A.6.11
  • Please provide an unambiguous diagram defining the presentation plane and the φc=0 axe during testing. Refer to “PICC Test Bench and Signal Characteristics” for the definition of φc. Note: The Presentation Plane shall be defined so that positions at z=0cm are testable during Analogue testing. (No offset due to the wearable product can be considered.) L1A.7 – Resonant frequency L1A.7.1 – Resonant frequency of the antenna: L1A.8 – Analogue parameters L1A.8.1 – Does your product support active modulation? L1A.8.2 – Does your product support passive modulation? L1A.8.3 – Does the device always use the same analogue parameters for EMV transactions regardless of AID routing? L1A.8.3.1 – If no, please explain what can cause the analogue parameters used by the device in the field to change? MHz Yes No Yes No Yes No Number: Level 1 digital characteristics with UICC for payment application L1D.1 – Types of UICCs supported L1D.1.1 – Does the mobile product support UICCs requesting random UID? Note: the mobile product may support UICCs requesting random UIDs and have a fixed UID. UICC Slot 1: Yes No L1D.1.2 – Does the mobile product support UICCs requesting random PUPI? Note: the mobile product may support UICCs requesting random PUPIs and have a fixed PUPI Note: If the mobile product does not support Type B, then it does not support random PUPI. UICC Slot 1: Yes No L1D.2 – Digital configuration L1D.2.1 – Can the UICC have an impact on the digital configuration of the mobile product? UICC Slot 1: Yes No L1D.2.1.1 – If no, does the mobile product support only specific protocol configurations i.e. is the number of digital configurations limited? UICC Slot 1: Yes No L1D.2.1.1.1 – If yes, indicate the number of configurations Note: Please, document the configurations in Appendix A UICC Slot 1: L1D.2.1.2 – Can the digital configurations be changed by the laboratory? UICC Slot 1: Yes No L1D.3 – Legacy behavior L1D.3.1 – Does the mobile product implement a legacy behaviour by accepting an ATTRIB command with b8-b5 of Param 3 different from (0000)b with UICC as EEUT? Note: If the mobile product does not support Type B, the answer shall be “No” UICC slot 1: Yes No L1D.3.2 – Does the mobile product implement a legacy behaviour by accepting I-Blocks with bit b6 of PCB set to ‘1’ with UICC as EEUT? UICC slot 1: Yes No L1D.3.3 – Does the mobile product implement a legacy behaviour by accepting R-blocks with bit b2 of PCB set to ‘0’ with UICC as EEUT? UICC slot 1: Yes No L1D.3.4 – Does the mobile product implement a legacy behaviour by accepting the Power level indication of S(WTX) different from ‘00’ with UICC as EEUT? UICC slot 1: Yes No L1D.3.5 – Does the mobile product implement a legacy behaviour by accepting S-Blocks (e.g. S-DESELECT or S(WTX) block frame) with bit b1 of PCB set to ‘1’ with UICC as EEUT? UICC slot 1: Yes No UICC Slot 2: Yes No UICC Slot 2: Yes No UICC Slot 2: Yes No UICC Slot 2: Yes No UICC Slot 2: UICC Slot 2: Yes No UICC slot 2: Yes No UICC slot 2: Yes No UICC slot 2: Yes No UICC slot 2: Yes No UICC slot 2: Yes No Level 1 digital characteristics with eSE or eUICC for payment application L1D.4 – Digital configuration L1D.4.1 – Does the mobile product support only specific protocol configurations i.e. is the number of digital configurations limited? Yes No Number: L1D.4.1.1 – If yes, indicate the number of configurations Note: Please, document the configurations in Appendix A L1D.4.2 – Can the digital configurations be changed by the Laboratory? L1D.5 – Legacy Behavior L1D.5.1 – Does the mobile product implement a legacy behaviour by accepting an ATTRIB command with b8-b5 of Param 3 different from (0000)b with eSE or eUICC as EEUT? Note: If the mobile product does not support Type B, the answer shall be “No” L1D.5.2 – Does the mobile product implement a legacy behaviour by accepting I-Blocks with bit b6 of PCB set to ‘1’ with eSE or eUICC as EEUT? L1D.5.3 – Does the mobile product implement a legacy behaviour by accepting R-blocks with bit b2 of PCB set to ‘0’ with eSE or eUICC as EEUT? L1D.5.4 – Does the mobile product implement a legacy behaviour by accepting the Power level indication of S(WTX) different from ‘00’ with eSE or eUICC as EEUT? L1D.5.5 – Does the mobile product implement a legacy behaviour by accepting S-Blocks (e.g. S-DESELECT or S(WTX) block frame) with bit b1 of PCB set to ‘1’ with eSE or eUICC as EEUT? Yes No Yes No Yes No Yes No Yes No Yes No Level 1 digital characteristics with HCE for payment application L1D.6 – Digital configuration L1D.6.1 – Does the mobile product support only specific protocol configurations i.e. is the number of digital configurations limited? Yes No L1D.6.1.1 – If yes, indicate the number of configurations Note: Please, document the configurations in Appendix A L1D.6.2 – Can the digital configurations be changed by the laboratory? Yes No L1D.7 – Legacy behavior L1D.7.1 – Does the mobile product implement a legacy behaviour by accepting an ATTRIB command with b8-b5 of Param 3 different from (0000)b with HCE as EEUT? Note: If the mobile product does not support Type B, the answer shall be “No” Yes No L1D.7.2 – Does the mobile product implement a legacy behaviour by accepting I-Blocks with bit b6 of PCB set to ‘1’ with HCE as EEUT? Yes No L1D.7.3 – Does the mobile product implement a legacy behaviour by accepting R-blocks with bit b2 of PCB set to ‘0’ with HCE as EEUT? Yes No L1D.7.4 – Does the mobile product implement a legacy behaviour by Yes No accepting the Power level indication of S(WTX) different from ‘00’ with HCE as EEUT? L1D.7.5 – Does the mobile product implement a legacy behaviour by accepting S-Blocks (e.g. S-DESELECT or S(WTX) block frame) with bit b1 of PCB set to ‘1’ with HCE as EEUT? Yes No Number: Digital signatures Product provider I hereby declare that the above referenced mobile product currently is and will remain in compliance with the above referenced EMV specifications for all mandatory and supported optional requirements. Comments Signature Laboratory I hereby declare that this ICS document has been reviewed, and that all product information is consistent throughout the ICS. Comments Signature EMVCo Card Type Approval Secretariat Signature Number: Appendix A Information on specific protocol configurations In case the mobile product supports only specific protocol configurations on an EE, provide in the table below the list of the identifiers of the specific protocol configuration available for this EE. For each specific protocol configuration, you shall provide the list of EE where it is available as well as the detailed values of all parameters. Parameter Execution environment1 Specific protocol configuration identifier Type A support ATQA value UID size UID value (random/or value if fixed) Last SAK value ATS value FSCI Supported bit rates SFGI FWI NAD support CID support Test profile/configuration E.g. UICC_2, eSE and HCE e.g. Spec AB Yes 01 00h Single “random” FBh 06 78 00 00 00 00h 8h 00h 0h 0h 0b 0b Comments 1 This row shall contain the list of EE where the specific protocol configuration is available. Number: of 15 Parameter Historical bytes Can PICC send MiFare NAK Type B support ATQB (not extended) PUPI value (random/or value if fixed) Application Data Supported bit rates FSCI FWI NAD support CID support Ext ATQB support (when performing CB015) SFGI value Test profile/configuration “empty” No Yes 50 55 55 55 55 00 00 00 00 00 81 50h 55 55 55 55h 00 00 00 00h 00h 8h 5h 0b 0b No NA Number: Comments of 15