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EMV® 3-D Secure Split-SDK Specification v2.3.1.0 Disposition of Comments

3-D Secure
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Draft Specification & Bulletin Industry Feedback Form Company Name: Primary Contact Name: Working Group or Task Force: 3-D Secure Working Group Document: 3-D Secure Split-SDK Specification Version 2.3.1.0 – Draft Date: July 2022 EA/Sub1 Clause No./ Subclause No. /Annex) Paragraph/ Figure/Tabl e/Note Type of comment2 Comment (justification for change) EA 2.4 Note te I have a question about the note added to section 2.4 about the recommendation to use the Device Acknowledgement Message Extension. The note mentions that 3DS Server operators are encouraged to use the message extension, however I’m wondering whether the message extension will be constructed by the 3DS Server or the Split-SDK Server? In the latter case the 3DS Server would just be forwarding the received message extension from the Split-SDK Server and in that case maybe the note should also encourage the Split-SDK provider to use the Device Acknowledgement Message Extension? Proposed change Status (Accept, Reject, In progress) EMVCo Use Only EMVCo observations on each comment submitted Accept The role of the 3DS Server is to integrate the 3DS Requestor Environment with the DS. The 3DS Server collects the necessary data elements from any or all of the components in the 3DS Requestor Environment, which includes the Split-SDK Server. The 3DS specifications do not cover the integration between the 3DS Server and the 3DS Requestor Environment. Therefore, they do not provide any detail on the functions of any components in this environment. From the point of view of the 3DS specifications, the SplitSDK Server may construct the message extension, but the 3DS Server remains the sender and ensures the correct content and JSON structure. 1 EA/Sub = EMVCo Associate or Subscriber company (enter a 2-3 letter abbreviation for commenting) 2 Type of comment: ge = general te = technical ed = editorial – For technical comments, please indicate whether your comment is a MAJOR or MINOR technical comment. © 2022 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Draft Specification & Bulletin Industry Feedback Form Company Name: Primary Contact Name: Working Group or Task Force: 3-D Secure Working Group Document: 3-D Secure Split-SDK Specification Version 2.3.1.0 – Draft Date: July 2022 EA/Sub1 Clause No./ Subclause No. /Annex) Paragraph/ Figure/Tabl e/Note Type of comment2 Comment (justification for change) EA ed Bookmarks are missing in the PDF document. Proposed change Can bookmarks for Chapter/Section/Subsection/etc. titles be added, please? It makes navigating the document and looking up specific parts of the specifications much more convenient. Status (Accept, Reject, In progress) EMVCo Use Only EMVCo observations on each comment submitted Accept The public release will include the bookmarks. 1 EA/Sub = EMVCo Associate or Subscriber company (enter a 2-3 letter abbreviation for commenting) 2 Type of comment: ge = general te = technical ed = editorial – For technical comments, please indicate whether your comment is a MAJOR or MINOR technical comment. © 2022 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries.