3DSA Bulletin nº 23: Project Based Qualification Program for Split-SDK variants

© 2023-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Page 1 EMV ® 3-D Secure Approval Bulletin No. 23 Second Edition June 2026 Project-based Qualification Program (PBQP) for 3DS Split-SDK products supporting 3-D Secure Protocol Version 2.3.1 Applicability This approval bulletin applies to the approval process of the EMV ® 3-D Secure (3DS) Products supporting the EMV® 3-D Split-SDK Specification version 2.3.1.0. Related Documents • EMV ® 3-D Secure Protocol and Core Functions Specification version 2.3.1.1 • EMV ® 3-D Secure SDK Specifications version 2.3.1.1 • EMV ® 3-D Split-SDK Specification version 2.3.1.0 • EMV ® 3DS SDK - Device Information – Data Version 1.7 • EMV ® 3-D Secure Approval – Administrative Process - latest version Effective Date Immediately Description This edition 2 of the Approval Bulletin 23 sunsets the previous edition 1 and the Project-based Qualification Program (PBQP) that had been introduced to qualify the implementation of the Split-SDK Test Plan by the Test Platform Providers for all variants (Native, Shell, Browser). Please contact your Test Platform and Testing Laboratory Provider on their qualification for each Split- SDK variant or check their status on the EMVCo website before starting the testing of a 3DS Split-SDK product compliant with 3DS Protocol Version 2.3.1. For additional information , please contact the EMVCo 3DS Secretariat. © 2023-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Page 2 Legal Notice This document is subject to change by EMVCo at any time. This document does not create any binding obligations upon EMVCo or any third party regarding the subject matter of this document, which obligations will exist, if at all, only to the extent set forth in separate written agreements executed by EMVCo or such third parties. In the absence of such a written agreement, no product provider, test laboratory or any other third party should rely on this document, and EMVCo shall not be liable for any such reliance. 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