EMV®Level 1 Specifications for Payment Systems: EMV Contactless Interface Specification

2026-01-06T00:00:00+00:00 v4.0 Specifications

Contactless

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EMV® Level 1 Specifications for Payment Systems EMV® Contactless Interface Specification Version 4.0 January 2026 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 Legal Notice The EMV® Specifications are provided “AS IS” without warranties of any kind, and EMVCo neither assumes nor accepts any liability for any errors or omissions contained in these Specifications. EMVCO DISCLAIMS ALL REPRESENTATIONS AND WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE AND NON-INFRINGEMENT, AS TO THESE SPECIFICATIONS. EMVCo makes no representations or warranties with respect to intellectual property rights of any third parties in or in relation to the Specifications. EMVCo undertakes no responsibility to determine whether any implementation of the EMV® Specifications may violate, infringe, or otherwise exercise the patent, copyright, trademark, trade secret, know-how, or other intellectual property rights of third parties, and thus any person who implements any part of the EMV® Specifications should consult an intellectual property attorney before any such implementation. Without limiting the foregoing, the Specifications may provide for the use of public key encryption and other technology, which may be the subject matter of patents in several countries. Any party seeking to implement these Specifications is solely responsible for determining whether its activities require a licence to any such technology, including for patents on public key encryption technology. EMVCo shall not be liable under any theory for any party’s infringement of any intellectual property rights in connection with the EMV® Specifications. January 2026 Page 2 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 Revision Log – Version 4.0 The following changes have been made since the publication of Version 3.2. Some of the numbering and cross references in this version have been updated to reflect changes introduced by the published bulletins. The numbering of existing requirements did not change, unless explicitly stated otherwise. Incorporated changes described in the following Specification Updates: Specification Bulletin No. 282: PPS0 and PPS1 RFU Value Handling Specification Bulletin No. 283: PCD Carrier Phase Drift Specification Bulletin No. 300: PICC Presence Check Procedure Specification Bulletin No. 303: Adding an Optional Suspend and a Mandatory Suspend in the Polling Loop Specification Bulletin No. 315: Introducing EMV – TEST PCD 2 Other changes: Included FWTDESELECT in the definition of FDTPICC,MAX in section 4.8.1 A number of editorial and cosmetic changes Changed unit of FWTDESELECT from etu to 1/fc January 2026 Page 3 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 Contents EMV® Contactless Interface Speciﬁcation............................................................................. 1 Revision Log – Version 4.0 .............................................................................................. 3 Contents.......................................................................................................................... 4 Figures .......................................................................................................................... 10 Tables ............................................................................................................................ 12 Requirements ............................................................................................................... 15 1 General ................................................................................................................ 19 1.1 Scope and Audience ............................................................................................ 19 1.2 Related Information............................................................................................. 19 1.3 Normative References ......................................................................................... 20 1.4 Acknowledgment................................................................................................. 20 1.5 Deﬁnitions ........................................................................................................... 21 1.6 Notational Conventions....................................................................................... 23 1.6.1 1.6.2 1.6.3 1.6.4 Abbreviations........................................................................................... 23 Notations ................................................................................................. 26 Terminology and Conventions ................................................................. 27 Reserved for Future Use (RFU) ................................................................ 28 2 Introduction......................................................................................................... 29 2.1 Contactless System .............................................................................................. 29 2.2 EMV Contactless Level 1 Test Equipment............................................................ 30 2.2.1 2.2.2 2.2.3 2.2.4 EMV – TEST PCDs..................................................................................... 31 EMV – TEST CMR ..................................................................................... 34 EMV – TEST PICCs .................................................................................... 35 IQ Demodulation Test Equipment ........................................................... 37 2.3 Landing Plane ...................................................................................................... 38 2.4 Operating Volume................................................................................................ 38 2.5 Overview.............................................................................................................. 40 3 Radio Frequency Power and Signal Interface...................................................... 42 3.1 Introduction......................................................................................................... 42 3.1.1 Transmission and Reception Requirements ............................................ 42 January 2026 Page 4 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 Contents 3.1.2 Function Properly .................................................................................... 43 3.1.3 Temperature and Humidity ..................................................................... 43 3.2 RF Power.............................................................................................................. 44 3.2.1 PCD Requirements for Power Transfer PCD to PICC ................................ 45 3.2.2 PICC Requirements for Power Transfer PCD to PICC ............................... 46 3.2.3 Inﬂuence of the PICC on the Operating Field .......................................... 51 3.2.4 PCD Requirement for the Carrier Frequency fc ....................................... 53 3.2.5 PICC Requirement for the Carrier Frequency fS,c..................................... 54 3.2.6 PCD Requirements for Resetting the Operating Field ............................. 57 3.2.7 PICC Requirements for Power-oﬀ............................................................ 58 3.2.8 PICC Requirements for Power-on ............................................................ 61 3.2.9 PCD Requirements for Power-oﬀ of the Operating Field ........................ 62 3.2.10 PCD Requirements for Suspending the Operating Field.......................... 63 3.3 Signal Interface PCD to PICC ................................................................................ 64 3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 Introduction............................................................................................. 64 PCD Requirements for Modulation PCD to PICC – Type A....................... 65 PICC Requirements for Modulation PCD to PICC – Type A...................... 68 PCD Requirements for Modulation PCD to PICC – Type B....................... 71 PICC Requirements for Modulation PCD to PICC – Type B ...................... 74 3.4 Signal Interface PICC to PCD ................................................................................ 78 3.4.1 3.4.2 3.4.3 3.4.4 3.4.5 Introduction............................................................................................. 78 PICC Requirements for Load Modulation ................................................ 80 PICC Requirements for Subcarrier Modulation – Type A ........................ 83 PICC Requirements for Subcarrier Modulation – Type B ........................ 84 PCD Requirements for Modulation PICC to PCD ..................................... 85 3.5 IQ Demodulation ................................................................................................. 87 3.5.1 Introduction............................................................................................. 87 3.5.2 PCD Requirements for IQ Demodulation ................................................ 87 4 Sequences and Frames ........................................................................................ 89 4.1 Introduction......................................................................................................... 89 4.1.1 4.1.2 4.1.3 Sequence ................................................................................................. 89 Frames ..................................................................................................... 89 Coding Schemes ...................................................................................... 91 4.2 Bit Rate ................................................................................................................ 93 4.3 Synchronisation ................................................................................................... 94 January 2026 Page 5 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 Contents 4.3.1 Type A – Synchronisation ........................................................................ 94 4.3.2 Type B – Synchronisation......................................................................... 94 4.4 Bit Coding ............................................................................................................ 98 4.4.1 4.4.2 4.4.3 4.4.4 Bit Coding PCD → PICC – Type A ............................................................. 98 Bit Coding PICC → PCD – Type A ........................................................... 100 Bit Coding PCD → PICC – Type B ........................................................... 102 Bit Coding PICC → PCD – Type B ........................................................... 103 4.5 Symbol Synchronisation .................................................................................... 105 4.6 De-synchronisation............................................................................................ 107 4.6.1 Type A – De-synchronisation ................................................................. 107 4.6.2 Type B – De-synchronisation ................................................................. 108 4.7 Frames ............................................................................................................... 110 4.7.1 4.7.2 4.7.3 4.7.4 Type A – Frame Format ......................................................................... 110 Type B – Frame Format.......................................................................... 112 FSD (Frame Size for proximity coupling Device) .................................... 113 FSC (Frame Size for proximity Card) ...................................................... 114 4.8 Timing Requirements ........................................................................................ 115 4.8.1 4.8.2 4.8.3 Frame Delay Time PCD → PICC ............................................................. 115 Frame Delay Time PICC → PCD ............................................................. 130 Summary................................................................................................ 139 4.9 EMD Handling.................................................................................................... 140 4.9.1 tnn,min ...................................................................................................... 140 4.9.2 PCD EMD Handling ................................................................................ 142 5 Type A – Commands and Responses ................................................................. 143 5.1 Type A – Command Set...................................................................................... 143 5.2 Type A – CRC_A.................................................................................................. 145 5.3 WUPA and REQA................................................................................................ 146 5.3.1 WUPA and REQA Command .................................................................. 146 5.3.2 WUPA and REQA Response (ATQA) ....................................................... 146 5.4 ANTICOLLISION .................................................................................................. 149 5.4.1 ANTICOLLISION Command .................................................................... 149 5.4.2 ANTICOLLISION Response (UID CLn) ..................................................... 150 5.5 SELECT................................................................................................................ 151 5.5.1 SELECT Command .................................................................................. 151 January 2026 Page 6 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Contents 5.5.2 Response – Select Acknowledge – SAK ................................................. 152 5.6 HLTA ................................................................................................................... 153 5.6.1 HLTA Command...................................................................................... 153 5.6.2 HLTA Response....................................................................................... 153 5.7 Request for Answer to Select (RATS) ................................................................. 154 5.7.1 RATS Command ..................................................................................... 154 5.7.2 RATS Response (Answer To Select) ........................................................ 156 5.8 Protocol Parameter Selection (PPS) .................................................................. 163 5.8.1 PPS Command ....................................................................................... 163 5.8.2 PPS Response......................................................................................... 166 6 Type B – Commands and Responses ................................................................. 167 6.1 Type B – Command Set...................................................................................... 167 6.2 Type B – CRC_B .................................................................................................. 168 6.3 WUPB and REQB................................................................................................ 169 6.3.1 WUPB and REQB Command .................................................................. 169 6.3.2 WUPB and REQB Response (ATQB) ....................................................... 172 6.4 ATTRIB................................................................................................................ 179 6.4.1 ATTRIB Command .................................................................................. 179 6.4.2 ATTRIB Response ................................................................................... 186 6.5 HLTB ................................................................................................................... 188 6.5.1 HLTB Command ..................................................................................... 188 6.5.2 HLTB Response....................................................................................... 188 7 Type A – PICC State Machine............................................................................. 189 7.1 State Diagram .................................................................................................... 189 7.2 Type A PICC States ............................................................................................. 192 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 7.2.6 7.2.7 7.2.8 POWER-OFF State .................................................................................. 192 IDLE State............................................................................................... 192 READY and READY* States ..................................................................... 193 READY' and READY'* States ................................................................... 194 READY" and READY"* States.................................................................. 195 ACTIVE and ACTIVE* States ................................................................... 196 PROTOCOL State .................................................................................... 197 HALT State.............................................................................................. 198 January 2026 Page 7 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Contents 8 Type B – PICC State Machine............................................................................. 199 8.1 State Diagram .................................................................................................... 199 8.2 Type B PICC States ............................................................................................. 201 8.2.1 8.2.2 8.2.3 8.2.4 8.2.5 POWER-OFF State .................................................................................. 201 IDLE State............................................................................................... 201 READY State ........................................................................................... 202 ACTIVE State .......................................................................................... 203 HALT State.............................................................................................. 203 9 PCD Processing .................................................................................................. 204 9.1 Main Loop.......................................................................................................... 204 9.1.1 Main Loop – Informative ....................................................................... 204 9.1.2 Main Loop – Normative......................................................................... 206 9.2 Polling ................................................................................................................ 207 9.3 Collision Detection............................................................................................. 212 9.3.1 9.3.2 9.3.3 General Collision Detection ................................................................... 213 Type A Collision Detection..................................................................... 214 Type B Collision Detection ..................................................................... 220 9.4 Activation........................................................................................................... 222 9.4.1 Type A Activation ................................................................................... 222 9.4.2 Type B Activation ................................................................................... 222 9.5 Transaction Completion..................................................................................... 223 9.5.1 Removal ................................................................................................. 223 9.5.2 Presence Check...................................................................................... 227 9.6 Exception Processing ......................................................................................... 229 10 Half-Duplex Block Transmission Protocol .......................................................... 231 10.1 Block Format...................................................................................................... 231 10.1.1 Block Length .......................................................................................... 232 10.1.2 Prologue Field ........................................................................................ 232 10.1.3 Information Field ................................................................................... 235 10.1.4 Epilogue ﬁeld ......................................................................................... 235 10.1.5 Protocol Error ........................................................................................ 235 10.2 Frame Waiting Time Extension.......................................................................... 236 10.2.1 Power Level Indicator ............................................................................ 236 10.2.2 WTXM .................................................................................................... 237 January 2026 Page 8 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Contents 10.3 Protocol Operation ............................................................................................ 240 10.3.1 General Rules......................................................................................... 240 10.3.2 Chaining ................................................................................................. 240 10.3.3 Block Numbering Rules ......................................................................... 243 10.3.4 Block Handling Rules ............................................................................. 244 10.3.5 Exception Processing ............................................................................. 246 10.3.6 DESELECT Processing ............................................................................. 249 Annex A Values ................................................................................................................ 250 A.1 Operating Volume.............................................................................................. 250 A.2 RF Power and Signal Interface ........................................................................... 250 A.3 Set-up Values for Test Equipment...................................................................... 254 A.4 Sequences and Frames ...................................................................................... 255 A.5 PCD Processing .................................................................................................. 256 A.6 Protocol Operation ............................................................................................ 256 Annex B Position Conventions ......................................................................................... 257 January 2026 Page 9 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Figures Figures Figure 2.1: PCD and PICC Conﬁguration ............................................................................ 29 Figure 2.2: EMV – TEST PCD 1............................................................................................ 32 Figure 2.3: EMV – TEST PCD 2............................................................................................ 33 Figure 2.4: EMV – TEST CMR.............................................................................................. 34 Figure 2.5: EMV – TEST PICC 1 ........................................................................................... 36 Figure 2.6: EMV – TEST PICC 3 ........................................................................................... 36 Figure 2.7: Operating Volume............................................................................................ 38 Figure 2.8: Power Zones .................................................................................................... 39 Figure 2.9: Communication Protocol Layers ...................................................................... 40 Figure 3.1: Lower Level – Type A ....................................................................................... 67 Figure 3.2: Modulation PCD to PICC – Type B.................................................................... 73 Figure 3.3: Load Modulation.............................................................................................. 78 Figure 3.4: BPSK ................................................................................................................. 79 Figure 3.5: Start of Subcarrier Modulation – Type A ......................................................... 83 Figure 3.6: Allowed Phase Shifts – Type B ......................................................................... 84 Figure 4.1: Frame Format for Type A and Type B .............................................................. 90 Figure 4.2: On-Oﬀ-Keying .................................................................................................. 91 Figure 4.3: Coding Schemes............................................................................................... 91 Figure 4.4: PICC Start of Sequence .................................................................................... 94 Figure 4.5: PCD Start of Sequence ..................................................................................... 95 Figure 4.6: Modiﬁed Miller Coding with ASK 100%........................................................... 98 Figure 4.7: Manchester Coding with OOK ....................................................................... 100 Figure 4.8: NRZ-L Coding with ASK 10%........................................................................... 102 Figure 4.9: NRZ-L Coding with BPSK ................................................................................ 103 Figure 4.10: Short Frame ................................................................................................. 110 Figure 4.11: Standard Frame ........................................................................................... 110 Figure 4.12: Type B Character Format ............................................................................. 112 Figure 4.13: Type B – Frame Format................................................................................ 112 Figure 4.14: FDTA,PICC........................................................................................................ 116 Figure 4.15: End of PCD Command – Type A ................................................................... 117 Figure 4.16: Start of PICC Response (Positive Modulation) – Type A .............................. 118 Figure 4.17: Start of PICC Response (Negative Modulation) – Type A ............................ 118 Figure 4.18: Start of PICC Response (Example of mixed modulation starting with a positive part cycle) – Type A.......................................................................... 119 Figure 4.19: FDTB,PICC ........................................................................................................ 121 Figure 4.20: End of PCD Command – Type B ................................................................... 121 January 2026 Page 10 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 Figures Figure 4.21: Start of PICC Response (Extended Low Phase Change) – Type B ................ 122 Figure 4.22: Start of PICC Response (Extended High Phase Change) – Type B ............... 123 Figure 4.23: Start of Unmodulated Subcarrier of PICC Response (Positive Modulation)127 Figure 4.24: Start of Unmodulated Subcarrier of PICC Response (Negative Modulation) ....................................................................................................................... 127 Figure 4.25: Start of Unmodulated Subcarrier of PICC Response (Example of Mixed Modulation Starting with Positive Part Cycle)............................................... 128 Figure 4.26: FDTA,PCD ........................................................................................................ 130 Figure 4.27: End of PICC Response (Positive Modulation) – Type A................................ 131 Figure 4.28: End of PICC Response (Negative Modulation) – Type A .............................. 131 Figure 4.29: End of PICC Response (Example of mixed modulation ending with a negative part cycle) – Type A ....................................................................................... 132 Figure 4.30: Start of PCD Command – Type A ................................................................. 132 Figure 4.31: FDTB,PCD ........................................................................................................ 133 Figure 4.32: End of PICC Response (Extended Low Phase Change) – Type B.................. 134 Figure 4.33: End of PICC Response (Extended High Phase Change) – Type B ................. 134 Figure 4.34: Start of PCD Command – Type B ................................................................. 135 Figure 4.35: tnn,min for Type A ........................................................................................... 140 Figure 4.36: tnn,min for Type B ........................................................................................... 141 Figure 5.1: Position of CRC_A within a Standard Frame.................................................. 145 Figure 6.1: Position of a CRC_B within a Frame............................................................... 168 Figure 7.1: PICC Type A State Diagram ............................................................................ 191 Figure 8.1: PICC Type B State Diagram............................................................................. 200 Figure 9.1: Terminal Main Loop ....................................................................................... 205 Figure 9.2: Polling ............................................................................................................ 208 Figure 9.3: Type A Collision Detection ............................................................................. 219 Figure 9.4: Type B Collision Detection ............................................................................. 221 Figure 9.5: Removal of PICC of Type A and PICC of Type B.............................................. 226 Figure 9.6: Presence Check Procedure ............................................................................ 228 Figure 10.1: Block Format ................................................................................................ 231 Figure 10.2: Chaining ....................................................................................................... 242 January 2026 Page 11 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Tables Tables Table 1.1: Abbreviations .................................................................................................... 23 Table 1.2: Notations........................................................................................................... 26 Table 3.1: Conﬁgurations Transmit and Receive................................................................ 42 Table 3.2: Measurement of Power Transfer PCD to PICC (PCD Transmission) .................. 45 Table 3.3: Measurement of Power Transfer PCD to PICC on EMV – TEST PCD 1 – Type A (PICC Reception) .............................................................................................. 46 Table 3.4: Measurement of Power Transfer PCD to PICC on EMV – TEST PCD 2 – Type A (PICC Reception) .............................................................................................. 47 Table 3.5: Measurement of Power Transfer PCD to PICC on EMV – TEST PCD 1 – Type B (PICC Reception) .............................................................................................. 48 Table 3.6: Measurement of Power Transfer PCD to PICC on EMV – TEST PCD 2 – Type B (PICC Reception) .............................................................................................. 49 Table 3.7: Measurement of the Inﬂuence of the PICC on the Operating Field ................. 51 Table 3.8: Measurement of Carrier Frequency fc (PCD Transmission)............................... 53 Table 3.9: Measurement of Carrier Frequency fS,c (PICC Reception) – Type A .................. 54 Table 3.10: Measurement of Carrier Frequency fS,c (PICC Reception) – Type B ................ 55 Table 3.11: Measurement of Resetting the Operating Field.............................................. 57 Table 3.12: Measurement of PICC Power-oﬀ – Type A...................................................... 58 Table 3.13: Measurement of PICC Power-oﬀ – Type B ...................................................... 59 Table 3.14: Measurement of PICC Power-on..................................................................... 61 Table 3.15: Measurement of Power-oﬀ of the Operating Field ........................................ 62 Table 3.16: Measurement of Suspending the Operating Field .......................................... 63 Table 3.17: Measurement of Modulation PCD to PICC – Type A (PCD Transmission) ....... 65 Table 3.18: Measurement of Modulation PCD to PICC on EMV – TEST PCD 1 – Type A (PICC Reception) .............................................................................................. 68 Table 3.19: Measurement of Modulation PCD to PICC on EMV – TEST PCD 2 – Type A (PICC Reception) .............................................................................................. 69 Table 3.20: Measurement of Modulation PCD to PICC – Type B (PCD Transmission) ...... 71 Table 3.21: Measurement of PCD to PICC Modulation on EMV – TEST PCD 1 – Type B (PICC Reception) .............................................................................................. 74 Table 3.22: Measurement of PCD to PICC Modulation on EMV – TEST PCD 2 – Type B (PICC Reception) .............................................................................................. 75 Table 3.23: Measurement of Load Modulation Characteristics on EMV – TEST PCD 1 (PICC Transmission) ......................................................................................... 80 Table 3.24: Measurement of Load Modulation Characteristics on EMV – TEST PCD 2 (PICC Transmission) ......................................................................................... 81 Table 3.25: Measurement of Modulation PICC to PCD (PCD Reception) .......................... 85 January 2026 Page 12 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Tables Table 3.26: Measurement of IQ Modulation PICC to PCD (PCD Reception)...................... 87 Table 4.1: Overview of Coding Schemes............................................................................ 92 Table 4.2: FDTA,PICC and Logic Value of Last Bit before EoF .............................................. 119 Table 4.3: FDTA,PICC and Command Type .......................................................................... 119 Table 4.4: Type A – Timings ............................................................................................. 139 Table 4.5: Type B – Timings.............................................................................................. 139 Table 5.1: Type A – Command Set ................................................................................... 143 Table 5.2: Coding of WUPA and REQA within a Short Frame .......................................... 146 Table 5.3: Byte 1 of ATQA................................................................................................. 146 Table 5.4: Byte 2 of ATQA................................................................................................. 147 Table 5.5: Coding of ANTICOLLISION Command.............................................................. 149 Table 5.6: Coding of SEL................................................................................................... 149 Table 5.7: UID CLn ............................................................................................................ 150 Table 5.8: Coding of SELECT Command ........................................................................... 151 Table 5.9: Coding of SEL................................................................................................... 151 Table 5.10: Coding of SAK ................................................................................................ 152 Table 5.11: Coding of HLTA Command............................................................................. 153 Table 5.12: Coding of RATS Command............................................................................. 154 Table 5.13: Format of RATS Parameter Byte (PARAM)..................................................... 154 Table 5.14: FSDI to FSD Conversion ................................................................................. 154 Table 5.15: Structure of the ATS ...................................................................................... 156 Table 5.16: Coding of Format Byte T0.............................................................................. 157 Table 5.17: FSCI to FSC Conversion .................................................................................. 157 Table 5.18: Coding of Interface Byte TA(1) ...................................................................... 158 Table 5.19: Coding of Interface Byte TB(1) ...................................................................... 160 Table 5.20: Coding of Interface Byte TC(1) ...................................................................... 161 Table 5.21: Coding of PPS Command............................................................................... 163 Table 5.22: Coding of PPSS of the PPS Command ........................................................... 164 Table 5.23: Coding of PPS0 .............................................................................................. 164 Table 5.24: Coding of PPS1 .............................................................................................. 165 Table 5.25: Coding of Selected Divisor Integer ................................................................ 165 Table 5.26: Coding of PPS Response ................................................................................ 166 Table 6.1: Type B – Command Set ................................................................................... 167 Table 6.2: WUPB and REQB Command Format ............................................................... 169 Table 6.3: Coding of PARAM Byte Included in WUPB and REQB Command.................... 170 Table 6.4: ATQB Format ................................................................................................... 172 Table 6.5: Protocol Info Format ....................................................................................... 173 January 2026 Page 13 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Tables Table 6.6: Bit Rates Supported by the PICC ..................................................................... 173 Table 6.7: FSC in Terms of Max_Frame_Size.................................................................... 174 Table 6.8: Protocol_Type ................................................................................................. 175 Table 6.9: Protocol Types Supported by the PICC............................................................ 175 Table 6.10: Application Data Coding Supported by the PICC .......................................... 177 Table 6.11: Frame Options Supported by the PICC ......................................................... 178 Table 6.12: ATTRIB Command Format ............................................................................. 179 Table 6.13: Coding of Param 1 of the ATTRIB Command................................................. 180 Table 6.14: Coding of Param 2 of the ATTRIB Command................................................. 181 Table 6.15: FSD in Terms of Max_Frame_Size ................................................................. 181 Table 6.16: Coding of b8 and b7 of Param 2.................................................................... 182 Table 6.17: Coding of b6 and b5 of Param 2.................................................................... 182 Table 6.18: Coding of Param 3 of the ATTRIB Command................................................. 183 Table 6.19: Coding of Param 4 of the ATTRIB Command................................................. 184 Table 6.20: ATTRIB Response Format .............................................................................. 186 Table 6.21: HLTB Command Format ................................................................................ 188 Table 6.22: HLTB Response Format.................................................................................. 188 Table 10.1: Coding of b8-b7 of PCB ................................................................................. 232 Table 10.2: Coding of I-block PCB .................................................................................... 233 Table 10.3: Coding of R-block PCB ................................................................................... 233 Table 10.4: Coding of S-block PCB ................................................................................... 234 Table 10.5: Coding of INF Field of an S(WTX) Request .................................................... 236 Table 10.6: Coding of INF Field of an S(WTX) Response .................................................. 237 Table A.1: Operating Volume ........................................................................................... 250 Table A.2: RF Power and Signal Interface ........................................................................ 251 Table A.3: Minimum Value of Vpp,1 .................................................................................. 252 Table A.4: Minimum Value of Vpp,2 .................................................................................. 253 Table A.5: Set-up Values for EMV Contactless Level 1 Test Equipment........................... 254 Table A.6: Sequences and Frames ................................................................................... 255 Table A.7: PCD Processing................................................................................................ 256 Table A.8: Protocol Operation.......................................................................................... 256 January 2026 Page 14 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 Requirements Requirements Requirements 1.1: RFU ...................................................................................................... 28 Requirements 3.1: Power Transfer PCD to PICC (PCD Transmission) ................................ 45 Requirements 3.2: Power Transfer PCD to PICC (PICC Reception) .................................... 50 Requirements 3.3: Inﬂuence of the PICC on the Operating Field...................................... 52 Requirements 3.4: Carrier Frequency fc and Phase Drift ∆Φc (PCD Transmission) ........... 53 Requirements 3.5: Carrier Frequency fS,c (PICC Reception)............................................... 56 Requirements 3.6: Reset Operating Field (PCD Transmission) .......................................... 57 Requirements 3.7: PICC Power-oﬀ .................................................................................... 60 Requirements 3.8: PICC Power-on..................................................................................... 61 Requirements 3.9: Power-oﬀ of the Operating Field (PCD Transmission)......................... 62 Requirements 3.10: Suspension of the Operating Field (PCD Transmission) .................... 63 Requirements 3.11: Modulation PCD to PICC – Type A (PCD Transmission) ..................... 66 Requirements 3.12: Modulation PCD to PICC – Type A (PICC Reception) ......................... 70 Requirements 3.13: Modulation PCD to PICC – Type B (PCD Transmission) ..................... 72 Requirements 3.14: Modulation PCD to PICC – Type B (PICC Reception) ......................... 77 Requirements 3.15: Load Modulation Characteristics (PICC Transmission)...................... 82 Requirements 3.16: Subcarrier Modulation – Type A (PICC Transmission)....................... 83 Requirements 3.17: Subcarrier Modulation – Type B (PICC Transmission) ....................... 84 Requirements 3.18: Modulation PICC to PCD (PCD Reception) ........................................ 86 Requirements 3.19: IQ Modulation PICC to PCD (PCD Reception).................................... 88 Requirements 4.1: Bit Rate ................................................................................................ 93 Requirements 4.2: Synchronisation PCD → PICC – Type B................................................ 95 Requirements 4.3: Synchronisation PICC → PCD – Type B................................................ 96 Requirements 4.4: Bit Coding PCD → PICC – Type A......................................................... 99 Requirements 4.5: Loaded State ..................................................................................... 101 Requirements 4.6: Bit Coding PICC → PCD – Type A....................................................... 101 Requirements 4.7: Bit Coding PCD → PICC – Type B....................................................... 102 Requirements 4.8: Bit Coding PICC → PCD – Type B....................................................... 104 Requirements 4.9: Type B Character Separation............................................................. 105 Requirements 4.10: Type B Bit Boundaries PCD to PICC ................................................. 105 Requirements 4.11: Type B Bit Boundaries PICC to PCD ................................................. 106 Requirements 4.12: End of Sequence PCD → PICC – Type A .......................................... 107 Requirements 4.13: End of Sequence PICC → PCD – Type A .......................................... 107 Requirements 4.14: End of Sequence PCD → PICC – Type B .......................................... 108 Requirements 4.15: End of Sequence PICC → PCD – Type B .......................................... 109 January 2026 Page 15 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Requirements Requirements 4.16: Type A – Frame Format ................................................................... 111 Requirements 4.17: Type B – Character Format.............................................................. 112 Requirements 4.18: FSD .................................................................................................. 113 Requirements 4.19: FSC................................................................................................... 114 Requirements 4.20: FDTA,PICC ........................................................................................... 120 Requirements 4.21: FDTA,PICC,MIN ...................................................................................... 120 Requirements 4.22: FDTA,PICC for WUPA, REQA, SELECT, and ANTICOLLISION................. 120 Requirements 4.23: FDTB,PICC,MIN ...................................................................................... 123 Requirements 4.24: Frame Waiting Time ........................................................................ 125 Requirements 4.25: Activation Frame Waiting Time....................................................... 126 Requirements 4.26: FWTATQB and TR0MAX for WUPB and REQB Commands ................... 129 Requirements 4.27: FDTPCD,MIN......................................................................................... 136 Requirements 4.28: SFGT ................................................................................................ 137 Requirements 4.29: tnn,min................................................................................................ 141 Requirements 4.30: PCD EMD Handling.......................................................................... 142 Requirements 5.1: Protocol Error – Type A ..................................................................... 144 Requirements 5.2: CRC_A ................................................................................................ 145 Requirements 5.3: PCD Handling of ATQA....................................................................... 147 Requirements 5.4: UID Length......................................................................................... 147 Requirements 5.5: Dynamic UID...................................................................................... 148 Requirements 5.6: PCD Handling of BCC ......................................................................... 150 Requirements 5.7: Type A PICC Compliance with ISO/IEC 14443-4 ................................ 152 Requirements 5.8: HLTA Response .................................................................................. 153 Requirements 5.9: FSDIMIN............................................................................................... 154 Requirements 5.10: PICC Handling of RFU values of FSDI............................................... 155 Requirements 5.11: Support of CID................................................................................. 155 Requirements 5.12: Length Byte TL of the ATS................................................................ 156 Requirements 5.13: FSCIMIN ............................................................................................. 157 Requirements 5.14: PCD Handling of RFU values of FSCI................................................ 157 Requirements 5.15: Format Byte T0 of the ATS............................................................... 158 Requirements 5.16: Format Byte TA(1) of the ATS .......................................................... 159 Requirements 5.17: PCD Handling of RFU bit b4 in TA(1) ............................................... 159 Requirements 5.18: Interface Byte TB(1) of the ATS ....................................................... 160 Requirements 5.19: Interface Byte TB(1) of the ATS ....................................................... 161 Requirements 5.20: Interface Byte TC(1) of the ATS ....................................................... 162 Requirements 5.21: Historical Bytes of the ATS .............................................................. 162 Requirements 5.22: PPS Command ................................................................................. 163 January 2026 Page 16 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Requirements Requirements 5.23: PPS0................................................................................................. 164 Requirements 5.24: PPS1................................................................................................. 165 Requirements 5.25: PPS Response .................................................................................. 166 Requirements 6.1: Protocol Error – Type B ..................................................................... 167 Requirements 6.2: CRC_B ................................................................................................ 168 Requirements 6.3: Application Family Indicator (AFI) ..................................................... 169 Requirements 6.4: Number of Slots (N) .......................................................................... 170 Requirements 6.5: Support for Extended ATQB .............................................................. 171 Requirements 6.6: PUPI in ATQB ..................................................................................... 172 Requirements 6.7: Application Data Field ....................................................................... 172 Requirements 6.8: Bit Rates Supported by the PICC ....................................................... 174 Requirements 6.9: PCD Handling of RFU bit b4 in Bit_Rate_Capability .......................... 174 Requirements 6.10: FSCIMIN ............................................................................................. 174 Requirements 6.11: PCD Handling of RFU Values of Max_Frame_Size........................... 175 Requirements 6.12: Type B Protocol Type supported by the PICC.................................. 176 Requirements 6.13: Minimum TR2.................................................................................. 176 Requirements 6.14: Maximum Value of FWI for Type B ................................................. 177 Requirements 6.15: Application Data Coding (ADC) ....................................................... 177 Requirements 6.16: Frame Options (FO) ......................................................................... 178 Requirements 6.17: SFGI ................................................................................................. 178 Requirements 6.18: PUPI in ATTRIB Command ............................................................... 179 Requirements 6.19: Coding of Param 1 of the ATTRIB Command .................................. 180 Requirements 6.20: FSDIMIN............................................................................................. 181 Requirements 6.21: PICC Handling of RFU values of Max_Frame_Size .......................... 181 Requirements 6.22: Setting the Bit Rate for Type B ........................................................ 182 Requirements 6.23: Coding and Handling of Param 3 of the ATTRIB Command ............ 183 Requirements 6.24: Coding of Param 4 of the ATTRIB Command .................................. 184 Requirements 6.25: Higher layer – INF............................................................................ 185 Requirements 6.26: CID in ATTRIB Response .................................................................. 186 Requirements 6.27: MBLI in ATTRIB Response................................................................ 186 Requirements 6.28: Higher layer – Response.................................................................. 187 Requirements 7.1: PICC Type A – State Machine ............................................................ 189 Requirements 7.2: Type A – IDLE State............................................................................ 192 Requirements 7.3: Type A – READY and READY* States.................................................. 193 Requirements 7.4: Type A – READY' and READY'* States ................................................ 194 Requirements 7.5: Type A – READY" and READY"* States............................................... 195 Requirements 7.6: Type A – ACTIVE and ACTIVE* States ................................................ 196 January 2026 Page 17 © 2018-2026 EMVCo, LLC. 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EMV® Level 1 Contactless Interface v4.0 Requirements Requirements 7.7: Type A – PROTOCOL State ................................................................. 197 Requirements 7.8: Type A – HALT State........................................................................... 198 Requirements 8.1: PICC Type B – State Machine ............................................................ 199 Requirements 8.2: Type B – IDLE State............................................................................ 201 Requirements 8.3: Type B – READY State ........................................................................ 202 Requirements 8.4: Type B – ACTIVE State ....................................................................... 203 Requirements 8.5: Type B – HALT State........................................................................... 203 Requirements 9.1: PCD Requirements Related to the Main Loop .................................. 206 Requirements 9.2: Polling................................................................................................ 209 Requirements 9.3: Collision Detection ............................................................................ 213 Requirements 9.4: Type A Collision Detection ................................................................ 214 Requirements 9.5: Type B Collision Detection ................................................................ 220 Requirements 9.6: Type A Activation .............................................................................. 222 Requirements 9.7: Type B Activation............................................................................... 222 Requirements 9.8: Transaction Completion .................................................................... 223 Requirements 9.9: Removal Procedure for Type A.......................................................... 224 Requirements 9.10: Removal Procedure for Type B........................................................ 225 Requirements 9.11: Presence Check Procedure.............................................................. 227 Requirements 9.12: Exception Processing....................................................................... 229 Requirements 10.1: Coding of S-block PCB ..................................................................... 234 Requirements 10.2: Protocol Error.................................................................................. 235 Requirements 10.3: Power Level Indication .................................................................... 236 Requirements 10.4: RFU Handling of S(WTX) Response ................................................. 237 Requirements 10.5: Frame Waiting Time Extension ....................................................... 238 Requirements 10.6: General Rules for Half-Duplex Transmission Protocol .................... 240 Requirements 10.7: General Chaining Rule..................................................................... 240 Requirements 10.8: Chaining Invocation......................................................................... 241 Requirements 10.9: Block Sizes during Chaining............................................................. 241 Requirements 10.10: Block Numbering Rules ................................................................. 243 Requirements 10.11: Block Handling Rules for both PCD and PICC ................................ 244 Requirements 10.12: Block Handling Rules for the PCD ................................................. 244 Requirements 10.13: Block Handling Rules for the PICC................................................. 245 Requirements 10.14: Exception Processing – PICC ......................................................... 246 Requirements 10.15: Exception Processing – PCD .......................................................... 246 Requirements 10.16: S(DESELECT) Response .................................................................. 249 January 2026 Page 18 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 1 General This chapter contains information that helps the reader understand and use this specification. 1.1 Scope and Audience This specification, the EMV Level 1 Specifications for Payment Systems, EMV Contactless Interface Specification, describes the minimum functionality required of Proximity Integrated Circuit Cards (PICCs) and Proximity Coupling Devices (PCDs) to ensure correct operation and interoperability independent of the application to be used. PICCs and PCDs may provide additional proprietary functionality and features, but these are beyond the scope of this specification and interoperability cannot be guaranteed. This specification is intended for use by manufacturers of PICCs and PCDs, system designers in payment systems, and financial institution staff responsible for implementing financial applications in PICCs and PCDs. 1.2 Related Information The following EMV documents provide information related to the subjects discussed in this specification. The latest version applies unless a publication date is explicitly stated. [PCD MANUAL] EMV Level 1 Specifications for Payment Systems – Contactless Test Equipment Specifications – PCD Manual [PICC MANUAL] EMV Level 1 Specifications for Payment Systems – Contactless Test Equipment Specifications – PICC Manual [CMR MANUAL] EMV Contactless Specifications for Payment Systems – Level 1 – Test Equipment Specifications – CMR Manual [DTE] EMV Contactless Terminal Level 1 Type Approval – Device Test Environment [SYMBOL GUIDE] EMVCo Contactless Symbol Reproduction Guidelines January 2026 Page 19 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 1 General 1.3 Normative References 1.3 Normative References The following standards contain provisions that are referenced in this specification. The latest version including all published amendments applies unless a publication date is explicitly stated. [ISO/IEC 7810] Identification cards – Physical characteristics. [ISO/IEC 14443-1] Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 1: Physical characteristics. [ISO/IEC 14443-2] Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 2: Radio frequency power and signal interface. [ISO/IEC 14443-3] Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 3: Initialization and anticollision. [ISO/IEC 14443-4] Identification cards – Contactless integrated circuit(s) cards – Proximity cards – Part 4: Transmission protocol. [ISO/IEC 13239] Information technology – Telecommunications and information exchange between systems – High-level data link control (HDLC) procedures. [ISO/IEC 10373-6] Identification cards – Test methods – Part 6: Proximity cards. 1.4 Acknowledgment Extracts from standards are reproduced on behalf of ISO with the permission of the British Standards Institution under licence number 2003SK/099. BSI & ISO publications can be obtained from: BSI Customer Services Phone: E-mail: Address: +44 (0) 20 8996 9001 cservices@bsi-global.com 389 Chiswick High Road London W4 4AL United Kingdom January 2026 Page 20 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 1 General 1.5 Definitions 1.5 Definitions The following terms are used in this specification: Collision Transmission by two or more PICCs in the same PCD energising field and during the same time period, such that the PCD is unable to distinguish from which PICC the data originated. EMV Contactless Level 1 Test Equipment EMV – TEST CMR Equipment for EMV testing, including: • EMV – TEST CMR • EMV – TEST PCDs • EMV – TEST PICCs A signal switching and conditioning unit for the EMV test bench. EMV – TEST PCD A PCD simulator used for EMV testing. EMV – TEST PICC A PICC simulator used for EMV testing. IQ TEST PICC A PICC simulator used for EMV testing. It is used for testing IQ demodulation capabilities of a PCD. Legacy A device depending on a behaviour permitted by the specification to accommodate existing products in the field. Future versions of the specification may not support that behaviour. A new product should be designed not to rely upon the continued acceptance of that behaviour. Modulation index The modulation index of an amplitude modulated signal is defined as: mi = ([A(t)]MAX – [A(t)]MIN) / ([A(t)]MAX + [A(t)]MIN) where A(t) is the envelope of the modulated carrier. Operating Field The magnetic field (HOV) created by the PCD within the Operating Volume. Operating Volume The 3-dimensional space in which the PCD can communicate with a PICC by means of a magnetic field. January 2026 Page 21 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 PCD Test Environment Protocol error Proximity IC Card (PICC) Proximity Coupling Device (PCD) Semantic error Syntax error Terminal Time-out error Transmission error 1 General 1.5 Definitions Test environment for testing the PCD requirements related to the RF Power and Signal Interface as described in [DTE]. A syntax or semantic error. Within these specifications, a PICC is considered to be a consumer token into which integrated circuit(s) and coupling means have been placed and in which communication to such integrated circuit(s) is done by inductive coupling in proximity of a coupling device. The consumer token may be a card of the ID 1 form factor (as defined in [ISO/IEC 7810]), a key fob, a mobile phone, or another form factor. The peripheral device of the terminal that uses inductive coupling to provide power to the PICC and also to control the data exchange with the PICC. A valid frame with no syntax error is received when it is not expected (Chapters 7, 8, 9 and 10). A valid frame is received with an invalid content: In this case the coding of the command or the block within the frame is not consistent with this specification (Chapters 5, 6 and 10). The device used in conjunction with the PICC at the point of transaction to perform a financial transaction. It incorporates the PCD and may also include other components and interfaces (e.g. host communication). No response has been sent by the PICC within the Frame Waiting Time (FWT). An invalid frame is detected by the receiver: Failure of a parity or CRC check, or determination that any of the signal modulation, the bit coding, the frame format, or the timing are not consistent with this specification (Chapters 3 and 4). January 2026 Page 22 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 1 General 1.6 Notational Conventions 1.6 Notational Conventions 1.6.1 Abbreviations The abbreviations listed in Table 1.1 are used in this specification. Abbreviation AC ACK ADC AFI ASK ATQA ATQB ATS ATTRIB BCC BPSK BSI CID CLn CMR CT CRC_A CRC_B D DC EDC EGT EMD EoF EoS etu FDT Table 1.1: Abbreviations AntiCollision Description Positive ACKnowledgement Application Data Coding, Type B Application Family Identifier, Type B Amplitude Shift Keying Answer To reQuest, Type A Answer To reQuest, Type B Answer To Select, Type A PICC selection command, Type B UID CLn check byte, Type A Binary Phase Shift Keying British Standards Institution Card IDentifier Cascade Level n, Type A Common Mode Rejection Cascade Tag, Type A Cyclic Redundancy Check error detection code for Type A Cyclic Redundancy Check error detection code for Type B Divisor Direct Current Error Detection Code Extra Guard Time, Type B Electromagnetic Disturbance End of Frame End of Sequence Elementary time unit Frame Delay Time January 2026 Page 23 © 2018-2026 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. EMV® Level 1 Contactless Interface v4.0 1 General 1.6 Notational Conventions Abbreviation fc FO fs FSC FSCI FSD FSDI FWI FWT HLTA HLTB HLZ IEC INF IQ ISO LLZ LSB MBL MBLI MSB NAD NAK n.a. NLZ NRZ-L OOK PCB PCD PICC PPS PPSR PPSS Carrier frequency Description Frame Option, Type B Subcarrier frequency Frame Size for proximity Card Frame Size for proximity Card Integer Frame Size for proximity coupling Device Frame Size for proximity coupling Device Integer Frame Waiting time Integer Frame Waiting Time HaLT command, Type A HaLT command, Type B High Linear load International Electrotechnical Commission INFormation field In-phase Quadrature International Organization for Standardization Low Linear load Least Significant Bit Maximum Buffer Length Maximum Buffer Length Index Most Significant Bit Node ADdress Negative AcKnowledgement Not Applicable Non Linear load Non-Return to Zero, (L for Level) On-Off Keying Protocol Control Byte Proximity Coupling Device (reader) Proximity IC Card Protocol and Parameter Selection Protocol and Parameter Selection Response Protocol and Parameter Selection Start January 2026 Page 24 © 2018-2026