SB n° 253: Errata for EMV® Book C-2

v2.9 Specification Bulletins
Contactless Acceptance Device

EMV<sup>®</sup> Specification Bulletin No. 253 April 2021 Errata for EMV Book C-2 (Version 2.9) This Specification Bulletin contains corrections for Book C-2 V2.9.

Applicability

This Specification Bulletin applies to:

  • EMV Contactless Specifications for Payment Systems, Book C-2, Kernel 2 Specification, Version 2.9, March 2020

Effective Date

  • 1 June 2021

Description

This Specification Bulletin corrects errors in Book C-2 v2.9.

Erratum 1 Change TAA.8 as follows: 8 (TAC-Online OR 'FFFFFFFFFC') No AND TVR = '0000000000' ? Yes TAA.8 IF [((Terminal Action Code – Online OR 'FFFFFFFFFC') AND Terminal Verification Results) = '0000000000'] THEN GOTO TAA.9 ELSE GOTO TAA.11 ENDIF

Erratum 2 Change TAA.14 as follows: 14 (TAC-Default OR FFFFFFFFFC AND No TVR = '0000000000' ? Yes TAA.14 IF [((Terminal Action Code – Default OR 'FFFFFFFFFC') AND Terminal Verification Results) = '0000000000'] THEN GOTO TAA.15 ELSE GOTO TAA.17 ENDIF

Legal Notice

Unless the user has an applicable separate agreement with EMVCo or with the applicable payment system, any and all uses of these Specifications is subject to the terms and conditions of the EMVCo Terms of Use agreement available at www.emvco.com and the following supplemental terms and conditions. Except as otherwise may be expressly provided in a separate agreement with EMVCo, the license granted in the EMVCo Terms of Use specifically excludes (a) the right to disclose, distribute or publicly display these Specifications or otherwise make these Specifications available to any third party, and (b) the right to make, use, sell, offer for sale, or import any software or hardware that practices, in whole or in part, these Specifications. Further, EMVCo does not grant any right to use the Kernel Specifications to develop contactless payment applications designed for use on a Card (or components of such applications). As used in these supplemental terms and conditions, the term "Card" means a proximity integrated circuit card or other device containing an integrated circuit chip designed to facilitate contactless payment transactions. Additionally, a Card may include a contact interface and/or magnetic stripe used to facilitate payment transactions. To use the Specifications to develop contactless payment applications designed for use on a Card (or components of such applications), please contact the applicable payment system. To use the Specifications to develop or manufacture products, or in any other manner not provided in the EMVCo Terms of Use, please contact EMVCo. These Specifications are provided "AS IS" without warranties of any kind, and EMVCo neither assumes nor accepts any liability for any errors or omissions contained in these Specifications. EMVCO DISCLAIMS ALL REPRESENTATIONS AND WARRANTIES, EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE AND NONINFRINGEMENT, AS TO THESE SPECIFICATIONS. EMVCo makes no representations or warranties with respect to intellectual property rights of any third parties in or in relation to the Specifications. EMVCo undertakes no responsibility to determine whether any implementation of these Specifications may violate, infringe, or otherwise exercise the patent, copyright, trademark, trade secret, know-how, or other intellectual property rights of third parties, and thus any person who implements any part of these Specifications should consult an intellectual property attorney before any such implementation. Without limiting the foregoing, the Specifications may provide for the use of public key encryption and other technology, which may be the subject matter of patents in several countries. Any party seeking to implement these Specifications is solely responsible for determining whether its activities require a license to any such technology, including for patents on public key encryption technology. EMVCo shall not be liable under any theory for any party's infringement of any intellectual property rights in connection with these Specifications.