EMV® Card Level 1 Type Approval – PICC Analogue Test Bench and Test Case Requirements

EMV® Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements Version 3.0b.r November 2025 © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page i Legal Notice This document summarizes EMVCo’s present plans for evaluation services and related policies and is subject to change by EMVCo at any time. This document does not create any binding obligations upon EMVCo or any third party regarding the subject matter of this document, which obligations will exist, if at all, only to the extent set forth in separate written agreements executed by EMVCo or such third parties. 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Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page ii Revision Log – 3.0b The following changes have been made to the document since the publication of Version 3.0b. Some of the numbering and cross references in this version have been updated to reflect changes introduced by the published bulletins. The numbering of existing requirements did not change, unless explicitly stated otherwise. Incorporated changes described in the following Specification Updates: None Other editorial changes: Editorial updates © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page iii Contents 1 Using this Manual ................................................................................................. 1 1.1 Purpose.................................................................................................. 1 1.2 Audience ................................................................................................ 1 1.3 Reference Documents............................................................................ 1 1.3.1 1.3.2 Standards Documents............................................................................ 1 Specification Documents ........................................................................ 2 1.4 Definitions .............................................................................................. 2 1.5 Notational Conventions .......................................................................... 4 1.5.1 Acronyms and Abbreviations.................................................................. 4 1.6 Terminology and Conventions ................................................................ 6 1.7 Support .................................................................................................. 6 2 Requirements for Testing Laboratories .............................................................. 7 2.1 Overview and Requirements .................................................................. 7 2.2 Recognition Requirements ..................................................................... 7 2.2.1 2.2.2 2.2.3 2.2.4 2.2.5 2.2.6 Use of EMV – TEST Equipment ............................................................. 7 Creation of the Test Bench..................................................................... 7 Approval of the Test Bench .................................................................... 7 Test Bench Organization ........................................................................ 8 Recognition by EMVCo .......................................................................... 8 Compliance to ISO 17025 ...................................................................... 8 2.3 Controlled Test Conditions ..................................................................... 9 2.3.1 2.3.2 2.3.3 Power Supply Conditions ....................................................................... 9 Temperature and Humidity ..................................................................... 9 RF Environment ..................................................................................... 9 3 Positioning Conventions and Requirements.................................................... 11 3.1 Importance of Positioning ..................................................................... 11 3.2 Conventions Regarding Positioning...................................................... 11 3.2.1 3.2.2 3.2.3 3.2.4 Positioning Characteristics for the EMV – TEST PCD .......................... 11 Positioning Characteristics for the EMV – TEST PICC ......................... 12 Positioning Characteristics for the PICC Under Test. ........................... 13 Relative Positioning of the PICC Under Test and EMV – TEST PCD ... 14 3.3 Operating Volume ................................................................................ 17 3.4 Positioning during Actual Set-ups and Tests ........................................ 18 3.4.1 3.4.2 Target Position Conventions ................................................................ 18 Summary.............................................................................................. 20 3.5 Positioning Accuracy ............................................................................ 20 4 EMV – TEST Equipment ..................................................................................... 22 4.1 EMV – TEST PICCs ............................................................................. 22 4.1.1 4.1.2 4.1.3 4.1.4 Description ........................................................................................... 22 Electrical Connectivity .......................................................................... 23 Positioning Characteristics ................................................................... 24 On-board Adjustment ........................................................................... 24 4.2 EMV – TEST PCD................................................................................ 26 4.2.1 Description ........................................................................................... 26 © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page iv 4.2.2 4.2.3 4.2.4 4.3 4.3.1 4.3.2 4.3.3 4.3.4 Electrical Connectivity .......................................................................... 27 Positioning Characteristics ................................................................... 27 On-board Adjustment ........................................................................... 27 EMV – TEST Common Mode Rejection Circuit Board .......................... 28 Description ........................................................................................... 28 Electrical Connectivity .......................................................................... 29 Other Common Mode Rejection Circuit Board Connections ................. 31 Common Mode Rejection Circuit Board Control ................................... 31 5 Requirements for the Test Bench...................................................................... 32 5.1 Overview .............................................................................................. 32 5.1.1 5.1.2 Test Bench Functions for Set-up .......................................................... 32 Test Bench Functions for Testing ......................................................... 33 5.2 Test Bench Functions........................................................................... 35 5.2.1 5.2.2 5.2.3 5.2.4 5.2.5 Signal Acquisition and Measurement on the EMV – TEST PICC.......... 35 Signal Acquisition/Measurement on [ISO/IEC 10373-6] Calibration Coil 1 38 EMV – TEST CMR control.................................................................... 39 PCD Emulation..................................................................................... 40 Signal Acquisition and Measurement on EMV – TEST PCD................. 42 5.3 Test Bench Support Functions ............................................................. 45 5.3.1 5.3.2 Purpose................................................................................................ 45 Requirements....................................................................................... 45 5.4 Summary of Signals Names and Parameters ....................................... 46 5.4.1 5.4.2 Signal Names....................................................................................... 46 Parameters .......................................................................................... 48 6 Executing an EMV Analogue Interface Test Session ....................................... 49 6.1 Preparation for Testing......................................................................... 49 6.2 Verifying Appropriateness .................................................................... 49 6.3 Identifying the Sample.......................................................................... 49 6.4 Powering the Sample ........................................................................... 50 6.5 Preparing the EMV Test Equipment ..................................................... 50 6.6 Sample Testing .................................................................................... 50 6.6.1 6.6.2 6.6.3 6.6.4 6.6.5 Sequence of Execution ........................................................................ 50 Test Results ......................................................................................... 50 Failed Procedures ................................................................................ 50 Generating a Report............................................................................. 51 Tasks after Completing a Test Campaign............................................. 51 7 Preparation of the EMV – TEST Equipment ...................................................... 52 7.1 General Requirements ......................................................................... 52 7.2 Preparing the EMV – TEST PICCs....................................................... 53 7.2.1 Verifying the EMV – TEST PICCs ........................................................ 53 7.3 Preparing the EMV – TEST PCD Antenna ........................................... 56 7.3.1 Verifying the EMV – TEST PCD Antenna ............................................. 56 7.4 Preparing the EMV – TEST CMR ......................................................... 59 7.4.1 7.4.2 Verifying the EMV – TEST CMR .......................................................... 59 EMV – TEST CMR Gain Measurement ................................................ 64 7.5 EMV – TEST PCD and EMV – TEST PICC Cross-Verification ............. 67 © 2010-2025 EMVCo, LLC. 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Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page v 7.5.1 Cross-Verifying the EMV – TEST PCD and the EMV – TEST PICCs ... 67 8 PICC Analogue Test Plan ................................................................................... 70 8.1 Prerequisites ........................................................................................ 70 8.2 Understanding the Two Types of Load Modulation............................... 71 8.2.1 8.2.2 Type A Load Modulation ...................................................................... 71 Type B Load Modulation ...................................................................... 72 8.3 Preliminary Set-ups .............................................................................. 73 8.3.1 Setting up the Test Bench Power ......................................................... 73 8.3.2 Setting up the Test Bench Modulation Parameters for Type A Communications................................................................................................... 75 8.3.3 Setting up the Test Bench Modulation Parameters for Type B Communications................................................................................................... 78 8.3.4 Setting up the PCD Emulation Device for Reset Test Cases ................ 81 8.4 PICC Performance Pre-Verification ...................................................... 83 8.4.1 8.4.2 8.4.3 8.4.4 PICC Transaction Time ........................................................................ 83 PICC Processing Time ......................................................................... 83 PICC Transmission Time ..................................................................... 83 Specific cases ...................................................................................... 84 8.5 Identifying PICC Test Cases ................................................................ 88 8.6 Measurement Uncertainty .................................................................... 89 8.7 Interpretation of the Measurement Results........................................... 92 8.7.1 8.7.2 Intermittent Results .............................................................................. 92 Successful Transaction Definition......................................................... 93 8.8 Performing PICC Test Cases ............................................................... 94 8.8.1 8.8.2 8.8.3 8.8.4 8.8.5 8.8.6 8.8.7 8.8.8 8.8.9 PICC Power Off and Power On States Field ........................................ 94 PICC Behaviour with Respect to the Radio Frequency Field .............. 103 PICC Responsiveness of a Type A PICC ........................................... 107 Verifying the PICC Transmission for Type A ...................................... 121 Bit Level Coding for a Type A PICC ................................................... 131 PICC Responsiveness of a Type B PICC ........................................... 135 Verifying the PICC Transmission for Type B ...................................... 155 Bit level Coding for a Type B PICC..................................................... 166 Performance Pre-Verification tests ..................................................... 179 A. PICC Acceptance Criteria ................................................................................ 183 A.1. PICC Acceptance Criteria Parameters and Values............................. 183 B. PICC Analogue Test Conditions ...................................................................... 185 B.1. EMV Test Equipment Set-up Values .................................................. 185 C. PCD Emulation : Frame Trails ......................................................................... 186 C.1. Transaction Completion ..................................................................... 186 C.2. Frame Trail for Type A PICC Tests – Single Size UID........................ 187 C.3. Frame Trail for Type A PICC tests – Double Size UID........................ 188 C.4. Frame Trail for Type A PICC tests - Triple Size UID........................... 189 C.5. FDTA,PCD ............................................................................................. 191 C.6. Frame Trail for Type B PICC Tests .................................................... 192 C.7. FDTB,PCD ............................................................................................. 194 D. Timing Measurements Methods ...................................................................... 195 © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page vi D.1. D.1.1. D.1.2. Setup of Cursors and their Positioning ............................................... 195 Summary Tables ................................................................................ 195 Cursors Positioning details ................................................................. 199 E. Flowchart diagram of CAB111 Test Procedure .............................................. 204 F. Additional test procedure for CA134 and CB134 ........................................... 205 © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page vii Figures Figure 3-1—EMV – TEST PCD Positioning Characteristics ................................................ 12 Figure 3-2—EMV – TEST PICC Positioning Characteristics ............................................... 13 Figure 3-3—Relative Positioning of Perfectly Aligned and Parallel PICC Under Test and EMV – TEST PCD ................................................................................................. 15 Figure 3-4—Four Possible Positions of a PICC Under Test ................................................ 16 Figure 3-5—Change of the Relationship between the φ=0 Axis of the EMV – TEST PCD and the φc=0 Axis of the PICC Under Test ........................................................... 17 Figure 3-6—Operating Volume ........................................................................................... 18 Figure 3-7— Label Points in a Plane of the Target Position ................................................ 20 Figure 4-1—EMV – TEST PICC 1, Version 3.0 (top view) ................................................... 22 Figure 4-2—EMV – TEST PICC 1, Version 3.0 (side view) ................................................. 24 Figure 4-3—EMV – TEST PCD, Version 1.2 ....................................................................... 26 Figure 4-4—EMV – TEST CMR Circuit Board, Version 2.1 ................................................. 28 Figure 5-1—Block Diagram of the Test Bench .................................................................... 32 Figure 5-2—Test Functions of the EMV PICC Analogue Test Bench .................................. 32 Figure 5-3—Block Diagram for PICC Testing ...................................................................... 33 Figure 5-4—Diagram for Signal Acquisition/Measurement on the EMV – TEST PICC ........ 36 Figure 5-5—Block Diagram for Signal Acquisition and Measurement on [ISO/IEC 10373-6] Calibration Coil 1 ........................................................................................... 38 Figure 5-6—Functional Blocks for the EMV – TEST CMR Control ...................................... 40 Figure 5-7—Functional Blocks for a PCD Emulator............................................................. 41 Figure 5-8—Block Diagram for Signal Acquisition and Measurement on the EMV – TEST PCD.................................................................................................................... 43 Figure 7-1—EMV – TEST PICC 1 Resonant Frequency ..................................................... 54 Figure 7-2—Connectivity for EMV – TEST PCD.................................................................. 56 Figure 7-3—EMV – TEST PCD Verification ........................................................................ 57 Figure 7-4—Diagram for the EMV – TEST CMR Signal Transmission Verification .............. 59 Figure 7-5—Diagram for the EMV – TEST CMR Delay Line Verification ............................. 61 Figure 7-6—Diagram for the EMV – TEST CMR Main Clock Verification ............................ 63 Figure 7-7—First Diagram for the EMV – TEST CMR Gain Measurement .......................... 64 Figure 7-8—Second Diagram for the EMV – TEST CMR Gain Measurement ..................... 65 Figure 7-9—EMV – TEST PCD and EMV – TEST PICC Cross-Verification ........................ 67 Figure 7-10—Diagram for the EMV – TEST PCD and EMV – TEST PICC Cross- Verification.................................................................................................................... 68 Figure 8-1—Type A Load Modulation Signal ....................................................................... 71 Figure 8-2—Type A Load Modulation.................................................................................. 71 Figure 8-3—Type B Load Modulation Signal ....................................................................... 72 Figure 8-4—Type B Load Modulation.................................................................................. 72 Figure 8-5—Diagram for the Test Bench Power.................................................................. 73 Figure 8-6—Diagram for the Test Bench Modulation Parameters ....................................... 75 Figure 8-7—Type A Timing Parameters .............................................................................. 76 Figure 8-8—Diagram for the Test Bench Modulation Parameters ....................................... 78 Figure 8-9—Type B Test Bench Modulation Parameters .................................................... 80 Figure 8-10—Diagram for the Test Bench Reset Parameters ............................................. 81 Figure 8.11—PICC Transaction Time ................................................................................. 84 Figure 8.12—Chaining ........................................................................................................ 85 Figure 8.13—Frame Waiting Time extension ...................................................................... 86 Figure 8.14—Frame Waiting Time extension ...................................................................... 87 Figure 8-15—Diagram to Set-up the Test Bench for PICC Testing...................................... 94 Figure 8-16—Search Paths Definition ............................................................................... 104 Figure 8-17—12 mm square search area definition........................................................... 105 Figure 8-18—Typical Lower and Upper Subcarrier Peaks of Load Modulation (Type A) ... 123 © 2010-2025 EMVCo, LLC. 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Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page viii Figure 8-19—Position of the X2 cursor ............................................................................. 124 Figure 8-20—Adjustment of the X2 cursor to the closest peak........................................... 125 Figure 8-21—Correct succession of sequences ................................................................ 125 Figure 8-22—Example of phase relation criteria not met ................................................... 128 Figure 8-23—Typical Lower and Upper Subcarrier Peaks of Load Modulation (Type B) ... 157 Figure 8-24—Cursors positioning...................................................................................... 158 Figure 8-25—Cursors positioning...................................................................................... 159 Figure 8-26—Phase changes alternation .......................................................................... 162 Figure 8-27—Subcarrier disappearance............................................................................ 162 Figure 8-28—Subcarrier only when data is to be transmitted ............................................ 163 Figure 8-29—Cursors positioning...................................................................................... 167 Figure 8-30—Timing Interval Measurement and Associated Cursors ................................ 170 Figure 8-31—X1 cursor...................................................................................................... 171 Figure 8-32—X2 cursor...................................................................................................... 172 Figure 8-33—X1 cursor...................................................................................................... 172 Figure 8-34—X2 cursor...................................................................................................... 172 Figure 8-35—X1 cursor...................................................................................................... 172 Figure 8-36—X1 cursor (tFSOFF ≠ 0) .................................................................................... 173 Figure 8-37—X1 cursor (tFSOFF = 0) .................................................................................... 173 Figure 8-38—X2 cursor...................................................................................................... 173 Figure 8-39—X2 cursor...................................................................................................... 173 Figure 8-40—X1 cursor...................................................................................................... 174 Figure 8-41—X2 cursor...................................................................................................... 174 Figure 8-42—X1 cursor...................................................................................................... 174 Figure 8-43—X2 cursor...................................................................................................... 175 Figure 8-44—Shorter modulated states duration ............................................................... 177 Figure 8-45—Longer modulated states duration ............................................................... 178 Figure C-1—Timing Diagram for FDTA,PCD......................................................................... 191 Figure C-2—Timing Diagram for FDTB,PCD......................................................................... 194 Figure D-1--Type A PCD Start .......................................................................................... 199 Figure D-2— Type A PCD End ......................................................................................... 199 Figure D-3— Type A PICC Start ....................................................................................... 200 Figure D-4— Type A PICC End ........................................................................................ 200 Figure D-5— Type B PCD Start ........................................................................................ 201 Figure D-6— Type B PCD End ......................................................................................... 201 Figure D-7— Type B PICC Start ....................................................................................... 202 Figure D-8— Type B PICC End ........................................................................................ 202 Figure D-9— Type B PICC Phase Shift............................................................................. 203 © 2010-2025 EMVCo, LLC. 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Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page ix Tables Table 3-1—Positioning Coordinate Definitions .................................................................... 15 Table 3-2—z Values and Associated r Identifiers ................................................................ 19 Table 3-3—r Values and Associated r Identifiers................................................................. 19 Table 3-4—φ Values and Associated f Identifiers................................................................ 19 Table 3-5—Label Point Identifiers and Associated φ Value................................................. 20 Table 4-1— EMV – TEST PICC Input Connector ................................................................ 23 Table 4-2— EMV – TEST PICC Output Connectors............................................................ 23 Table 4-3—Jumper J8 Settings ........................................................................................... 25 Table 4-4—Jumper J4 Settings ........................................................................................... 25 Table 4-5—EMV – TEST PCD Connectors ......................................................................... 27 Table 4-6—EMV – TEST CMR Input Connectors................................................................ 29 Table 4-7—EMV – TEST CMR Output Connectors ............................................................. 30 Table 4-8—EMV – TEST CMR Relay Features................................................................... 30 Table 4-9—EMV – TEST CMR Functions and Associated Controls .................................... 31 Table 5-1—Summary of the Signal Names and their Characteristics .................................. 37 Table 5-2—Summary of the Parameters and the Associated Signal Names ....................... 38 Table 5-3—Summary of the Signal Name and its Characteristics ....................................... 42 Table 5-4—Summary of the Signal Name and its Characteristics ....................................... 44 Table 5-5—Summary of the Parameter and its Characteristics ........................................... 44 Table 5-6—Summary of the Signals and their Components in the PICC EMV Contactless Test Bench................................................................................................ 46 Table 5-7—Summary of Component Signals in the PICC EMV Contactless Test Bench .... 47 Table 5-8—Parameters Applicable to the PICC EMV Contactless Test Bench.................... 48 Table 7-1— EMV – TEST PICC Characteristic Parameters for Verification Procedure........ 54 Table 7-2—Power Supply Parameters ................................................................................ 59 Table 7-3—EMV – TEST CMR Settings.............................................................................. 60 Table 7-4—Power Supply Parameters ................................................................................ 61 Table 7-5—EMV – TEST CMR Settings.............................................................................. 61 Table 7-6—Power Supply Parameters ................................................................................ 63 Table 7-7—EMV – TEST CMR Settings.............................................................................. 63 Table 7-8—Power Supply Parameters ................................................................................ 65 Table 7-9—EMV – TEST CMR settings .............................................................................. 65 Table 7-10— Measurement Results for EMV – TEST PCD and EMV – TEST PICC Cross Verification ......................................................................................................... 69 Table 8-1—Parameter and Signal Generation Uncertainty Range ...................................... 90 Table 8-2—Parameter and Environmental Condition Uncertainty Range ............................ 90 Table 8-3—Parameter and Measurement Uncertainty Range ............................................. 91 Table 8-4—EMV – TEST PCD Parameters ......................................................................... 95 Table 8-5—PCD Emulation Device Parameters .................................................................. 95 Table 8-6—EMV – TEST PCD Parameters ......................................................................... 97 Table 8-7—PCD Emulation Device Parameters .................................................................. 97 Table 8-8—EMV – TEST PCD Parameters ......................................................................... 99 Table 8-9—PCD Emulation Device Parameters .................................................................. 99 Table 8-10—EMV – TEST PCD Parameters ..................................................................... 101 Table 8-11—PCD Emulation Device Parameters .............................................................. 101 Table 8-12—z values to be tested for CAB111.zrf............................................................. 103 Table 8-13—Test Positions of Test CA121.zrf .................................................................. 108 Table 8-14—EMV – TEST PCD Parameters ..................................................................... 108 Table 8-15—Test Positions of Test CA122.zrf .................................................................. 109 Table 8-16—EMV – TEST PCD Parameters ..................................................................... 110 Table 8-17—Test Positions of Test CA123.zrf .................................................................. 111 Table 8-18—EMV – TEST PCD Parameters ..................................................................... 112 © 2010-2025 EMVCo, LLC. 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Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page x Table 8-19—EMV – TEST PCD Parameters ..................................................................... 113 Table 8-20—EMV – TEST PCD Parameters ..................................................................... 115 Table 8-21—Test Positions of Test CA126.z00................................................................. 117 Table 8-22—EMV – TEST PCD Parameters ..................................................................... 117 Table 8-23—Test Positions of Test CA127.z00................................................................. 119 Table 8-24—EMV – TEST PCD Parameters ..................................................................... 119 Table 8-25—Test positions of test CA131.zrf .................................................................... 121 Table 8-26—EMV – TEST PCD parameters ..................................................................... 122 Table 8-27—EMV – TEST CMR Parameter Settings ........................................................ 122 Table 8-28—EMV – TEST PCD Parameters ..................................................................... 124 Table 8-29—EMV – TEST PCD Parameters ..................................................................... 125 Table 8-30—EMV – TEST PCD Parameters ..................................................................... 125 Table 8-31—EMV – TEST PCD Parameters ..................................................................... 127 Table 8-32—Test Positions of Test CA134.z00................................................................. 129 Table 8-33—EMV – TEST PCD Parameters ..................................................................... 129 Table 8-34—EMV – TEST PCD Parameters ..................................................................... 131 Table 8-35—EMV – TEST PCD Parameters ..................................................................... 133 Table 8-36—Test Positions of Test CB121.zrf .................................................................. 136 Table 8-37—EMV – TEST PCD Parameters ..................................................................... 136 Table 8-38—Test Positions of Test CB122.zrf .................................................................. 137 Table 8-39—EMV – TEST PCD Parameters ..................................................................... 138 Table 8-40—EMV – TEST PCD Parameters ..................................................................... 138 Table 8-41—Test Positions of Test CB123.zrf .................................................................. 140 Table 8-42—EMV – TEST PCD Parameters ..................................................................... 141 Table 8-43—EMV – TEST PCD Parameters ..................................................................... 142 Table 8-44—EMV – TEST PCD Parameters ..................................................................... 144 Table 8-45—Test Positions of Test CB126.z00................................................................. 146 Table 8-46—EMV – TEST PCD Parameters ..................................................................... 146 Table 8-47—EMV – TEST PCD Parameters ..................................................................... 147 Table 8-48—EMV – TEST PCD Parameters ..................................................................... 147 Table 8-49—Test Positions for Test CB127.z00................................................................ 149 Table 8-50—EMV – TEST PCD Parameters ..................................................................... 149 Table 8-51—EMV – TEST PCD Parameters ..................................................................... 150 Table 8-52—EMV – TEST PCD Parameters ..................................................................... 150 Table 8-53—Test Positions for Test CB128.z00................................................................ 152 Table 8-54—EMV – TEST PCD Parameters ..................................................................... 153 Table 8-55—Frame Trail ................................................................................................... 153 Table 8-56—Test positions of test CB131.zrf .................................................................... 155 Table 8-57—EMV – TEST PCD parameters ..................................................................... 156 Table 8-58—EMV – TEST CMR Parameter Settings ........................................................ 156 Table 8-59—EMV – TEST PCD Parameters ..................................................................... 158 Table 8-60—EMV – TEST PCD Parameters ..................................................................... 159 Table 8-61—EMV – TEST PCD Parameters ..................................................................... 160 Table 8-62—EMV – TEST PCD Parameters ..................................................................... 161 Table 8-63—Test Positions of Test CB134.z00................................................................. 164 Table 8-64—EMV – TEST PCD Parameters ..................................................................... 164 Table 8-65—EMV – TEST PCD Parameters ..................................................................... 166 Table 8-66—EMV – TEST PCD Parameters ..................................................................... 169 Table 8-67—EMV – TEST PCD Parameters ..................................................................... 171 Table 8-68—EMV – TEST PCD Parameters ..................................................................... 177 Table 8-69—Test Positions of Test CA151.z00................................................................. 179 Table 8-70—EMV – TEST PCD parameters ..................................................................... 179 Table 8-71—Test Positions of Test CB151.z00................................................................. 181 Table 8-72—EMV – TEST PCD parameters ..................................................................... 181 © 2010-2025 EMVCo, LLC. 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Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page xi Table A-1—RF Power Transfer ......................................................................................... 183 Table A-2—Signal Interface .............................................................................................. 183 Table A-3—Minimum values of VPP ................................................................................... 183 Table A-4—Sequences and Frames ................................................................................. 184 Table B-1—Set-up Values for EMV Test Equipment ......................................................... 185 Table C-1—Continue C/R – APDU exchanges until transaction is completed ................... 186 Table C-2—Frame Trail for Type A PICC Tests with a Single Size UID ............................ 187 Table C-3—Frame Trail for Type A PICC Tests with a Double Size UID ........................... 188 Table C-4—Frame Trail for Type A PICC Tests with a Triple Size UID ............................. 190 Table C-5—PCD Test Values ........................................................................................... 190 Table C-6—Frame Trail for Type B PICC Tests ................................................................ 192 Table C-7—PCD Test Values ........................................................................................... 193 Table D-1—Type A Summary Table ................................................................................. 195 Table D-2—Type B Summary Table ................................................................................. 198 © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 1 of 207 1 Using this Manual 1.1 Purpose The EMV Contactless Card Level 1 Type Approval: PICC Analogue Test Bench and Test Case Requirements manual provides the requirements for procedures and test equipment used for testing the analogue interface PICCs. These requirements are in accordance with the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification 3.0, February 2018. 1.2 Audience This manual is provided to: • Testing Laboratories that perform PICC testing activities on behalf of EMVCo. 1.3 Reference Documents 1.3.1 Standards Documents Reference ISO 639: 1988 ISO/IEC 7810 ISO/IEC 14443-1 ISO/IEC 14443-2 ISO/IEC 14443-3 ISO/IEC 14443-4 ISO/IEC 13239 ISO / IEC 10373- 6 Description Codes for the representation of names and languages Identification cards – Physical characteristics Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 1: Physical characteristics Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 2: Radio frequency power and signal interface Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 3: Initialization and anti-collision Identification cards - Contactless integrated circuit(s) cards - Proximity cards - Part 4: Transmission protocol Information technology – Telecommunications and information exchange between systems – High-level data link control (HDLC) procedures Identification cards - Test Methods - Part 6: Proximity Cards © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 2 of 207 Reference ISO / IEC 17025:2017 ISO/IEC Guide 98-3:2008 ISO 5725:1994 (6 parts) Description General Requirements for the Competence of Calibration and Testing Laboratories Uncertainty of measurement ― Part 3: Guide to the expression of uncertainty in measurement (GUM:1995) Accuracy (trueness and precision) of measurement methods and results 1.3.2 Specification Documents Document EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification Version Issue Date Version 3.0, February 2018 EMV Specification Bulletin No.212: Timing Requirements for Time-out Handling First Edition, December 2018 EMV Specification Bulletin No.215: Polling Collision Indication First Edition, March 2019 EMV Specification Bulletin No.232: Type B Minimum Modulation Index First Edition, December 2019 EMV Specification Bulletin No.233: Update to Polling Collision Indication First Edition, (SB215) December 2019 EMV Specification Bulletin No.235: EMD Immunity for Type A EoS First Edition, March 2020 EMV Specification Bulletin No.245: IQ Modulation, First Edition First Edition, May 2020 EMV Contactless Symbol Reproduction Requirements Version 2.0, 30 October 2019 EMV Level 1 Specifications for Payment Systems – Contactless Test Equipment Specifications – PICC Manual Version 3.0, November 2018 EMV Contactless Specifications for Payment Systems – Level 1 – Test Version 2.1, Equipment Specifications – PCD Manual February 2012 EMV Contactless Specifications for Payment Systems – Level 1 – Test Version 2.1, Equipment Specifications – CMR Manual February 2012 1.4 Definitions Term Analogue Test Definition Set of tests that check the Radio Frequency characteristics of the hardware and software/firmware of the PCD against the EMV Specifications. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 3 of 207 Term EMV – TEST CMR EMV – TEST PCD EMV – TEST PICC [ISO/IEC 10373-6] Calibration Coil 1 Envelope Landing Plane Loopback mode Modulation Index Operating Volume Polling Presentation Plane Proximity Coupling Device (PCD) Proximity Integrated Circuit Card (PICC) Sample Set-up Terminal Test Bench Definition A hardware device qualified as reference equipment which is used with other EMV – TEST Equipment. Its purpose is to condition and switch signals between its inputs and outputs. A hardware device qualified as reference equipment which is used with other EMV Test Equipment. Its purpose is to simulate a PCD. A PICC simulator used for EMV testing Hardware device used to measure Reset and Power Off functions. Waveform connecting positive or negative peaks of oscillating signal. The designated surface area of a PCD where a user should place a PICC to obtain a successful transaction. Loopback involves cycling back information in a channel. Any data transmitted through such a channel is immediately received by the same channel. A device is in loopback mode after such a mode has been activated. The modulation index of an amplitude modulated signal is defined as mi = ([A(t)]MAX - [A(t)]MIN)/([A(t)]MAX + [A(t)]MIN)) where A(t) is the envelope of the modulated carrier. The 3-dimensional space in which the EMV – TEST PCD shall reliably communicate with a PICC by means of a magnetic field. Sequence during which the PCD sends alternatively WUPA and WUPB commands until a response is received. The plane of a PICC that faces the EMV – TEST PCD Landing Plane during testing. A hardware device that uses inductive coupling to provide power to the PICC and exchange data with the PICC. A hardware device containing an integrated circuit and capable of inductive coupling in the proximity of a coupling device. A physical implementation of a PICC or a PCD delivered to the Testing Laboratory for testing. Procedure to follow to prepare EMV Test Equipment before starting a test. Any device used to interact with a PICC and which operates to the requirements of the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification. This includes the PCD and may also include other components and interfaces. A specific test bench as described in the EMVCo Contactless Type Approval: PICC Analogue Test Bench and Test Case Requirements manual. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 4 of 207 Term Test Case Test Code Testing Laboratory Transaction Definition Test to verify a requirement at a specific position in the Operating Volume. Code to identify a Test Case. A facility recognised by EMVCo for performing EMV Contactless testing of the analogue interface for PICCs and PCDs. A sequence of logic interactions that the PICC and the Terminal shall execute as foreseen by the EMV Contactless application. The transaction starts with the first logic message from the PCD to the PICC. 1.5 Notational Conventions The following notational conventions apply: Notation z, r, φ , θ Description These four coordinates define the position of the PICC in the Operating Volume. The coordinates z, r, and φ are the coordinates of the centre of the Presentation Plane. The coordinate θ is the angle between the φ=0 axis of the PCD, and the φc=0 axis of the PICC. (zrf) Position label indicating the values for coordinates z, r, φ. xx Value. 1.5.1 Acronyms and Abbreviations A/D AC CLn APDU ASK ATQA ATQB ATTRIB BPSK CH0 CH1 Abbreviation Description Analogue to Digital Anti-collision Cascade Level n, Type A Application Protocol Data Unit Amplitude Shift Keying Answer To reQuest, Type A Answer To reQuest, Type B PICC Selection Command, Type B Binary Phase Shift Keying Channel 0 Channel 1 © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 5 of 207 CLK CMR CTA CUT DIV DSO EMC EMI EoF EoS etu fC fS HLTA HLTB I2C IC ICS ID-1 IEC MSa/s PAN PCD PICC RATS RF RH SELECT CLn SMA SoF SoS Trg TTL UID Abbreviation Clock Description Common Mode Rejection Card Type Approval Card Under Test Division Digital Sampling Oscilloscope ElectroMagnetic Compatibility ElectroMagnetic Interference End of Frame End of Sequence Elementary time unit Carrier Frequency Subcarrier Frequency Halt Command, Type A Halt Command, Type B Inter Integrated Circuit Integrated Circuit Implementation Conformance Statement Identification Card Format International Electro-technical Commission Mega Samples / Second Primary Account Number Proximity Coupling Device Proximity IC Card Request for Answer to Select, Type A Radio Frequency Relative Humidity Select Cascade Level n, Type A Sub-miniature version A Start of Frame Start of Sequence Trigger Transistor-Transistor Logic Unique Identifier, Type A © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 6 of 207 VPP VSWR WTX WTXM WUPA WUPB Abbreviation Description Peak to Peak Amplitude Voltage Voltage Standing Wave Ratio Waiting Time eXtension Waiting Time eXtension Multiplier Wake UP command, Type A Wake UP command, Type B 1.6 Terminology and Conventions The following words are used often in this specification and have a specific meaning: Shall Defines a product or system capability which is mandatory. May Defines a product or system capability which is optional or a statement which is informative only and is out of scope for this specification. Should Defines a product or system capability which is recommended. 1.7 Support For support regarding EMV Contactless analogue testing, refer to www.emvco.com. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r 2 Requirements for Testing Laboratories Page 7 of 207 2.1 Overview and Requirements The EMVCo Contactless Card Type Approval: PICC Analogue Test Bench and Test Case Requirements manual provides the Test Cases for testing the analogue interface of contactless cards. Analogue Interface Testing is one of the phases related to EMVCo Card Type Approval (CTA). 2.2 Recognition Requirements This section describes the requirements for passing full recognition. Replacing the test equipment by any other devices voids recognition for testing of the Analogue interface for EMV Contactless products. 2.2.1 Use of EMV – TEST Equipment The EMV Test Equipment includes the following: 2.2.1.1 EMV – TEST Proximity Integrated Circuit Card The EMV – TEST Proximity Integrated Circuit Card (PICC) emulates the radio frequency (RF) interface of EMV Contactless PICCs with different form factors and resonance frequencies. 2.2.1.2 EMV – TEST Proximity Coupling Device The EMV – TEST Proximity Coupling Device (PCD) emulates the RF interface of an EMV Contactless terminal. 2.2.1.3 EMV – TEST Common Mode Rejection Circuit Board The EMV – TEST Common Mode Rejection (CMR) circuit board aims at conditioning signals and switching them between its inputs and outputs for Test Bench set-ups. 2.2.2 Creation of the Test Bench The Testing Laboratory shall use an EMVCo qualified Test Tool for its test bench creation. The Test Tool shall include: • The EMV – TEST PICC 1 • The EMV – TEST PICC 2 • The EMV – TEST PCD • The EMV – TEST CMR • The [ISO/IEC 10373-6] Calibration Coil 1 2.2.3 Approval of the Test Bench The complete Test Bench shall be approved by EMVCo before the Testing Laboratory is allowed to provide official type approval testing services to PICC vendors. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 8 of 207 2.2.4 Test Bench Organization The Test Bench shall be governed by standard operating procedures. These procedures shall include: • Calibration • Operator training • Test bench operation • Test bench maintenance 2.2.4.1 Calibration Each item of measurement equipment shall be calibrated according to its calibration guidelines once a year. In any case, calibration shall be performed and documented in compliance with ISO/IEC 17025:2017 - General Requirements for the Competence of Calibration and Testing Laboratories. 2.2.4.2 Operator Training The Testing Laboratory shall ensure operator training to establish the required level of skills and expertise prior to any testing operations. To ensure the quality of testing, it is recommended that additional training be provided to personnel at least once per year and that close attention be paid to customer requirements. 2.2.4.3 Test Bench Operation The Testing Laboratory shall prepare and maintain documentation covering all relevant aspects of the design, implementation and operation of its proprietary Test Bench and its interaction with EMV – TEST Equipment that are necessary for correct operation. The Testing Laboratory shall operate the Test Bench in accordance with this documentation. 2.2.4.4 Test Bench Maintenance Each piece of measuring equipment shall undergo regular preventive maintenance, as required by its operating specifications. Written records of such maintenance operations shall be kept by the Testing Laboratory. In case of Test Bench failure, corrective maintenance shall take place to repair the Test Bench. The repaired Test Bench instruments and accessories shall be restored to their original Testing Laboratory approved standard performance levels. Written records of maintenance operations shall also be kept by the Testing Laboratory. 2.2.5 Recognition by EMVCo Only Testing Laboratories that are recognised by EMVCo are authorized to perform EMV Analogue Interface Testing. 2.2.6 Compliance to ISO 17025 The Testing Laboratory shall prove to EMVCo that they operate their Test Bench in compliance with ISO/IEC 17025:2017 General Requirements for the Competence of Calibration and Testing Laboratories. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 9 of 207 2.3 Controlled Test Conditions Analogue Interface Testing shall be carried out under controlled test conditions. Refer to ISO/IEC 17025, section 5.3 for details. 2.3.1 Power Supply Conditions At the beginning of a test session, the Testing Laboratory shall ensure that all electrical power supplies are within the range required for their purpose. Power supply voltage shall be measured with calibrated measurement equipment while the power supply is connected to the load. 2.3.2 Temperature and Humidity The normal temperature and humidity conditions for analogue tests should be any convenient combination of temperature and humidity within the following ranges: • Temperature: 23°C ± 3°C • Relative humidity: 40% to 60% RH When it is impossible to perform tests under these conditions, a note to this effect, stating the ambient temperature and relative humidity during the tests, shall be added to the test report. 2.3.3 RF Environment 2.3.3.1 Interference Issues EMI appears in many different forms. The most prominent in Testing Laboratories are the intentional radiators, such as PCDs and other communication devices in the 1 to 100 MHz range of the RF spectrum. In addition, cordless telephones and mobile telephones can be significant interferers in Testing Laboratories. Another form of interference is EMI radiated from incidental sources: devices and/or systems that are not designed to transmit intentionally. Such interference is also known as broadband emission or noise, and may be generated by any electronic or electrical device and/or system. This interference may lead to incorrect measurements. Extraneous noise may radiate from many sources. These are so numerous that it is virtually impossible for all of these suspected devices to be completely managed or controlled. However, efforts must be made to restrict the level of interference signals coming from these sources. The laboratory shall have ISO/IEC 17025 compliant procedures in place to monitor and control the RF environment to ensure that it does not adversely affect the quality of the measurements covered in this document. 2.3.3.2 Managing the RF Environment The RF spectrum (from 1 to 100 MHz) should be managed by documenting all frequencies as follows: • Using a spectrum analyzer for initial benchmarking of the level, nature, and impact of conducted and radiated RF signals that may affect the reliability of measurements. • Recording critical frequencies of other Testing Laboratory devices and/or systems. • Preventing the intrusion of interfering sources into vulnerable test frequencies (always scan for noise as well as intentional transmitters). © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 10 of 207 • Managing this information and knowing which frequencies are in use in the environment. • Scanning the Testing Laboratory environment regularly for possible broadband emissions, especially in areas where PICCs are in use or under test. RF cables connected to Test Bench equipment shall be as short as possible, ideally less than 50 cm. However, cables connected to computers and power supplies may have a length of up to 100 cm. This allows physical separation of the equipment to minimize coupling of electromagnetic disturbances to sensitive components of the Test Bench. The laboratory shall check the condition of the RF cables to minimize cable and connection losses as a regular maintenance item. Note: Equipment such as computers and power supplies should be selected to be as quiet as possible in terms of electro-magnetic disturbances towards the Test Bench. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 11 of 207 3 Positioning Conventions and Requirements 3.1 Importance of Positioning The correct positioning of PICCs during testing is of critical importance with EMV Contactless technology due to the fact that: • PICCs come in many forms, such as a card, a key fob, a mobile, a wearable, a token, etc. • The cardholder can either tap the PICC onto the PCD or simply wave it in front of the PCD. It is very important to understand the positioning characteristics applied to PICCs and PCDs and the relationship of these positioning characteristics to the Operating Volume. This ensures successful and repeatable testing of the various PICCs and PCDs available on the market. 3.2 Conventions Regarding Positioning For best accuracy and consistency in testing PICCs, the position of the device must be precisely set. 3.2.1 Positioning Characteristics for the EMV – TEST PCD The designated surface area of an EMV – TEST PCD against which a PICC is positioned during testing is referred to as the Landing Plane. The Landing plane is the surface of the Perspex stand. The Landing Plane of the EMV – TEST PCD is the plane located 15 mm above its antenna and parallel to this antenna. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Figure 3-1 shows the EMV – TEST PCD positioning characteristics. Page 12 of 207 Figure 3-1—EMV – TEST PCD Positioning Characteristics Note: The conventions used in this chapter relate to Appendix B of the EMV Level 1 Specifications for Payment Systems ― EMV Contactless Interface Specification. The Z axis of the EMV – TEST PCD is the axis which passes through the centre of the Landing Plane. The Z axis is orthogonal to the Landing Plane and points outwards from the EMV – TEST PCD Landing Plane top surface. The φ=0 axis is an axis defined on the Landing Plane to support the indication of the orientation of the EMV – TEST PICC versus the EMV – TEST PCD. In theory, the φ=0 axis is the writing direction of the PCD. 3.2.2 Positioning Characteristics for the EMV – TEST PICC When the EMV – TEST PICC is presented over the Landing Plane of the EMV – TEST PCD, the plane on the EMV – TEST PICC that faces the EMV – TEST PCD is called the Presentation Plane. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Figure 3-2 shows the EMV – TEST PICC positioning characteristics. Page 13 of 207 Figure 3-2—EMV – TEST PICC Positioning Characteristics The Presentation Plane is on the bottom of the EMV – TEST PICC (dotted lines). The ZC axis of the EMV – TEST PICC is an axis which passes through the centre of the Presentation Plane. This axis is also orthogonal to the Presentation Plane and points outwards from the bottom surface of the EMV – TEST PICC Presentation Plane. The point on the Presentation Plane where the ZC axis begins is called the centre of the Presentation Plane. The φC=0 axis is the axis defined on the Presentation Plane to identify the orientation of the EMV – TEST PICC versus the EMV – TEST PCD. 3.2.3 Positioning Characteristics for the PICC Under Test. Note: For testing, the PICC under test shall have markings indicating the centre of the Presentation Plane and the direction of the φC=0 axis. These marks should be placed by the Laboratory before starting the Type Approval test session. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 14 of 207 For ID-1 PICC testing, the centre of the Presentation Plane is the physical centre of the product . The Presentation Plane can be identified according to the first applicable rule amongst the following: If… A contact plate is present on the card. Then… The contact plate of the embedded chip is on the side opposite to the Presentation Plane, close to the left side. A magnetic stripe is present on the card. The magnetic stripe is on the side of the Presentation Plane towards the position (z, r, 3) of EMV – TEST PCD operating volume. A PAN (embossed or laser-engraved) is present on the card The PAN is on the side opposite to the Presentation Plane and readable from position (z, r, 6) to position (z, r, 0). Any text is present on the card. The text on the card is on the side opposite to the Presentation Plane and readable from position (z, r, 6) to position (z, r, 0). A contactless chip is identifiable on the card. The contactless chip is on the position (z, r, 6) side close to the position (z, r, 3) of EMV – TEST PCD operating volume. A contactless chip is not identifiable on the card. Contact the vendor to identify the front and upper sides of the card. The front side of the card shall be the side opposite to the Presentation Plane. The upper side of the card shall be towards position (z, r, 3) of EMV – TEST PCD operating volume. 3.2.4 Relative Positioning of the PICC Under Test and EMV – TEST PCD The Presentation Plane of the PICC Under Test shall remain parallel to the EMV–TEST PCD Landing Plane during all the testing session. © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r Page 15 of 207 Figure 3-3 shows the relative positioning of a PICC Under Test and EMV – TEST PCD when both are perfectly aligned and parallel. Figure 3-3—Relative Positioning of Perfectly Aligned and Parallel PICC Under Test and EMV – TEST PCD The position of the PICC Under Test relative to the EMV – TEST PCD is defined with four coordinates (z, r, φ and θ) as shown in Table 3-1: Coordinate z r φ θ Description Coordinate starting at the centre of the Presentation Plane: a point along the Z axis. Coordinate starting at the centre of the Presentation Plane: a point along the radius defined from the centre of the Presentation Plane (for example 25 mm). Coordinate starting at the centre of the Presentation Plane: this coordinate is explained in section 3.2.4.1. Angle defining the orientation of the EMV – TEST PICC with respect to the EMV – TEST PCD. This coordinate is explained in section 3.2.4.2. Unit mm mm Radians Radians Table 3-1—Positioning Coordinate Definitions © 2010-2025 EMVCo, LLC. All rights reserved. Reproduction, distribution and other use of this document is permitted only pursuant to the applicable agreement between the user and EMVCo found at www.emvco.com. EMV® is a registered trademark or trademark of EMVCo, LLC in the United States and other countries. Contactless Card Level 1 Type Approval PICC Analogue Test Bench and Test Case Requirements v3.0b.r 3.2.4.1 Definition of φ Angle Coordinate Figure 3-4 shows four possible positions of a PICC Under Test: Page 16 of 207 Figure 3-4—Four Possible Positions of a PICC Under Test This is a typical example where we have chosen to show certain positions of the PICC Under Test. The coordinate values are: • The z coordinate is a fixed value for all four positions of the PICC Under Test. • The r coordinate