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The latest changes across PCI SSC resources and EMVCo specifications.
RFC_Instructions_PCI-DSS-v4.0.1-June2026
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SB n°308 Contact Features Sunsetting P1
General Bulletin 60 2nd edition published on 30 July 2024 outlined the features to be sunsetted from the specifications with the aim of collectively improving security, optimising the usability of the specifications, simplifying editorial understanding, and …
GB n°60: EMV Contact Chip Features Sunsetting - P1
In the late 1990s, certain EMV Contact Chip Specification features were designed to support the rollout of the technology in various marketplaces. While these features played an important role at the time, the evolution of card payments technology and the …
DSB n°329: ECC ODE Key Derivation - Comment period ends 30 June 2026
This Specification Bulletin corrects an omission in the specification of ECC ODE in section 13 of Book 2. Specifically when decrypting encrypted data the card should not re-derive ODE keys if they have already been derived for the transaction. This is to …
DSB n°331: RRP Requirements for Kernel 2 - Comment period ends 26 June 2026
This Specification Bulletin introduces Terminal RRP Delay, Mean Terminal RRP Delay, Terminal RRP Spread and Mean Terminal RRP Transmission Time as new parameters associated with the processing of the ERRD Command. It mandates that the Terminal Spread does not …
SB n°327: Updates to Book B
This specification bulletin contains clarifications and corrections to Book B. (These are in addition to clarifications and corrections published in SB 299.) Details of Changes This specification bulletin discusses changes to the following topics: A. Table …
SB n°326: Updates to Book A
This specification bulletin contains clarifications and corrections to Book A. Details of Changes This specification bulletin discusses changes to the following topics: A. Start D B. Timeout Indicator C. Transaction Disposition Indication Times (shall to …